Inventor · disambiguated record
Ryohei Kitao
Also filed as: KITAO RYOHEI
15 granted patents·3 pending applications·55 citations·filing 2003–2020
90Inventor score
Top patents by PatentIndex Score
18 records- 0188US9673217B1Semiconductor device and method for manufacturing sameTOSHIBA KK·Filed 2016·Granted Jun 6, 2017·6 cites·6 claims
- 0286US7563705B2Manufacturing method of semiconductor deviceNEC ELECTRONICS CORP·Filed 2006·Granted Jul 21, 2009·10 cites·9 claims
- 0379US9275935B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Mar 1, 2016·4 cites·14 claims
- 0474US9779992B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2016·Granted Oct 3, 2017·2 cites·20 claims
- 0574US7833901B2Method for manufacturing a semiconductor device having a multi-layered insulating structure of SiOCH layers and an SiO2 layerNEC ELECTRONICS CORP·Filed 2006·Granted Nov 16, 2010·5 cites·44 claims
- 0672US9685517B2Semiconductor device, and method for producing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Jun 20, 2017·2 cites·6 claims
- 0772US7132732B2Semiconductor device having two distinct sioch layersNEC ELECTRONICS CORP·Filed 2004·Granted Nov 7, 2006·16 cites·33 claims
- 0869US10541250B2Method for manufacturing semiconductor deviceTOSHIBA MEMORY CORP·Filed 2016·Granted Jan 21, 2020·1 cites·11 claims
- 0963US7074698B2Method of fabricating semiconductor device using plasma-enhanced CVDNEC ELECTRONICS CORP·Filed 2004·Granted Jul 11, 2006·5 cites·27 claims
- 1062US11296109B2Method for manufacturing semiconductor deviceKIOXIA CORP·Filed 2019·Granted Apr 5, 2022·0 cites·19 claims
- 1158US12065725B2Film forming apparatus and film forming methodKIOXIA CORP·Filed 2020·Granted Aug 20, 2024·0 cites·21 claims
- 1250US6989328B2Method of manufacturing semiconductor device having damascene interconnectionNEC ELECTRONICS CORP·Filed 2004·Granted Jan 24, 2006·2 cites·12 claims
- 1347US8038864B2Method of fabricating semiconductor device, and plating apparatusRENESAS ELECTRONICS CORP·Filed 2007·Granted Oct 18, 2011·0 cites·15 claims
- 1447US7229916B2Method of manufacturing a semiconductor deviceNEC ELECTRONICS CORP·Filed 2004·Granted Jun 12, 2007·2 cites·6 claims
- 1542US10892300B2Storage deviceTOSHIBA MEMORY CORP·Filed 2019·Granted Jan 12, 2021·0 cites·15 claims
- 1641US2003155657A1Manufacturing method of semiconductor deviceNEC ELECTRONICS CORP·Filed 2003·Application pending·0 cites
- 1737US2011227224A1Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2011·Application pending·0 cites
- 1836US2018277667A1Semiconductor deviceTOSHIBA KK·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →