Inventor

HSUAN MIN-CHIH

TW26 patents

⚠️ This page may combine multiple inventors who share the name “HSUAN MIN-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HSUAN MIN-CHIH

UNITED MICROELECTRONICS CORP

Direct contact through hole type wafer structure

Multi-chip chip scale package

Method of forming package

Direct contact through hole type wafer structure

Face-to-face multi-chip package

Multi-chip chip scale package

Package-free bonding pad structure

Method of fabricating direct contact through hole type

Wafer level package

Wafer level integrated circuit structure and method of manufacturing the same

Cascade-type chip module

Method for manufacturing wafer level chip scale package structure

Repairable memory module and method of repairing memory modules

Preburn-in dynamic random access memory module and preburn-in circuit board thereof

Ultra-thin wafer level stack packaging method

Chip packaging process

Image-sensing module of image capture apparatus and manufacturing method thereof

Integrated audio/video sensor

HSUAN MIN-CHIH

Manufacturing method of wafer level chip scale package of image-sensing module

Local detection processing device and system

Portable information detection and processing device and system

INT COMMUNICATION SYSTEMS CORP

Facsimile message encryption system

UNITED MICROELECTRONIC CORP

Placement and routing for wafer scale memory

APTOS CORP

Flexible multi-chip module and method of making the same

HSUAN MIN CHIH

Attachment device for micro devices and wearable micro devices having the attachment device

LAI KELVIN YI TSE

Urinal cartridge and urinal having the same