Inventor
LEE KYOUNG YEON
KR27 patents
⚠️ This page may combine multiple inventors who share the name “LEE KYOUNG YEON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECH SINGAPORE HOLDING PTE LTD
19 patentsUS11075170B2Jul 27, 2021
Semiconductor package with EMI shield and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD1 citations72
US10818569B2Oct 27, 2020
Semiconductor device and a method of manufacturing a semiconductor device
AMKOR TECH SINGAPORE HOLDING PTE LTD4 citations72
US12046798B2Jul 23, 2024
Semiconductor devices and methods of manufacturing semiconductor devices
AMKOR TECH SINGAPORE HOLDING PTE LTD2 citations71
US12476171B2Nov 18, 2025
Land structure for semiconductor package and method therefor
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US12300584B2May 13, 2025
Semiconductor device including heat sink with exposed side from encapsulant and a method of manufacturing thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11915998B2Feb 27, 2024
Semiconductor device and a method of manufacturing a semiconductor device
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11908779B2Feb 20, 2024
Land structure for semiconductor package and method therefor
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11521918B2Dec 6, 2022
Semiconductor device having component mounted on connection bar and lead on top side of lead frame and method of manufacturing semiconductor device thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11417589B2Aug 16, 2022
Semiconductor device and a method of manufacturing a semiconductor device
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US12278154B2Apr 15, 2025
Semiconductor device and a method of manufacturing a semiconductor device
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations61
US12243834B2Mar 4, 2025
Semiconductor package with EMI shield and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations61
US11967567B2Apr 23, 2024
Semiconductor package with EMI shield and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations61
US11664289B2May 30, 2023
Semiconductor device and a method of manufacturing a semiconductor device
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations61
US11637073B2Apr 25, 2023
Semiconductor package with EMI shield and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations61
US12431611B2Sep 30, 2025
Semiconductor devices and methods of manufacturing semiconductor devices
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations60
US11742565B2Aug 29, 2023
Semiconductor devices and methods of manufacturing semiconductor devices
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations58
US11101540B2Aug 24, 2021
Semiconductor devices and methods of manufacturing semiconductor devices
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations58
US10840169B2Nov 17, 2020
Semiconductor device and a method of manufacturing a semiconductor device
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations51
US12489101B2Dec 2, 2025
Electronic devices having inner electronic component interposed between substrates and method of manufacturing the same
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations50
AMKOR TECHNOLOGY INC
8 patentsUS10553542B2Feb 4, 2020
Semiconductor package with EMI shield and fabricating method thereof
AMKOR TECHNOLOGY INC9 citations83
US11018079B2May 25, 2021
Land structure for semiconductor package and method therefor
AMKOR TECHNOLOGY INC3 citations73
US10020263B2Jul 10, 2018
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC3 citations72
US9911685B2Mar 6, 2018
Land structure for semiconductor package and method therefor
AMKOR TECHNOLOGY INC1 citations63
US9054089B2Jun 9, 2015
Lead frame package having discharge holes and method of manufacturing the same
AMKOR TECHNOLOGY INC2 citations62
US9129975B2Sep 8, 2015
Method of forming a thin substrate chip scale package device and structure
AMKOR TECHNOLOGY INC0 citations52
US9633932B2Apr 25, 2017
Lead frame package having discharge hole and method of manufacturing the same
AMKOR TECHNOLOGY INC0 citations51
US9293398B2Mar 22, 2016
Land structure for semiconductor package and method therefor
AMKOR TECHNOLOGY INC0 citations42