Inventor
TEYSSEYRE JEROME
SG54 patents
⚠️ This page may combine multiple inventors who share the name “TEYSSEYRE JEROME”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMICONDUCTOR COMPONENTS IND LLC
36 patentsUS11075137B2Jul 27, 2021
High power module package structures
SEMICONDUCTOR COMPONENTS IND LLC9 citations86
US10665525B2May 26, 2020
Heat transfer for power modules
SEMICONDUCTOR COMPONENTS IND LLC6 citations80
US11810775B2Nov 7, 2023
High power module package structures
SEMICONDUCTOR COMPONENTS IND LLC2 citations73
US10319670B2Jun 11, 2019
Package including multiple semiconductor devices
SEMICONDUCTOR COMPONENTS IND LLC1 citations73
US11621203B2Apr 4, 2023
SiC MOSFET semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC2 citations72
US11145571B2Oct 12, 2021
Heat transfer for power modules
SEMICONDUCTOR COMPONENTS IND LLC2 citations72
US11984424B2May 14, 2024
Semiconductor packages using package in package systems and related methods
SEMICONDUCTOR COMPONENTS IND LLC2 citations71
US11430777B2Aug 30, 2022
Power module package for direct cooling multiple power modules
SEMICONDUCTOR COMPONENTS IND LLC2 citations71
US12489080B2Dec 2, 2025
Flexible clip with aligner structure
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12463103B2Nov 4, 2025
SiC MOSFET semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12293955B2May 6, 2025
High power module package structures
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12266590B2Apr 1, 2025
Dual side direct cooling semiconductor package
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12142551B2Nov 12, 2024
Package including multiple semiconductor devices
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12074160B2Aug 27, 2024
Isolated 3D semiconductor device package with transistors attached to opposing sides of leadframe sharing leads
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11935817B2Mar 19, 2024
Power device module with dummy pad die layout
SEMICONDUCTOR COMPONENTS IND LLC1 citations62
US11908826B2Feb 20, 2024
Flexible clip with aligner structure
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11545421B2Jan 3, 2023
Package including multiple semiconductor devices
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11004777B2May 11, 2021
Semiconductor device assemblies
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US10910297B2Feb 2, 2021
Package including multiple semiconductor devices
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12417999B2Sep 16, 2025
Semiconductor packages using package in package systems and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations61
US12205918B2Jan 21, 2025
Submodule semiconductor package
SEMICONDUCTOR COMPONENTS IND LLC0 citations61
US11616006B2Mar 28, 2023
Semiconductor package with heatsink
SEMICONDUCTOR COMPONENTS IND LLC0 citations61
US11264311B2Mar 1, 2022
Clips for semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations61
US11222832B2Jan 11, 2022
Power semiconductor device package
SEMICONDUCTOR COMPONENTS IND LLC1 citations61
USD1113776SFeb 17, 2026
Power module package
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
USD1098055SOct 14, 2025
Power module package
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
USD1095474SSep 30, 2025
Power module package
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US12308364B2May 20, 2025
Power module package for direct cooling multiple power modules
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US12230551B2Feb 18, 2025
Immersion direct cooling modules
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US11848320B2Dec 19, 2023
Power module package for direct cooling multiple power modules
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US11735508B2Aug 22, 2023
Vertical and horizontal circuit assemblies
SEMICONDUCTOR COMPONENTS IND LLC0 citations59
US11610832B2Mar 21, 2023
Heat transfer for power modules
SEMICONDUCTOR COMPONENTS IND LLC0 citations59
US12543579B2Feb 3, 2026
Dual side cooled power module with three-dimensional direct bonded metal substrates
SEMICONDUCTOR COMPONENTS IND LLC0 citations52
US10553517B2Feb 4, 2020
High power module semiconductor package with multiple submodules
SEMICONDUCTOR COMPONENTS IND LLC0 citations51
US12471204B2Nov 11, 2025
Semiconductor device modules
SEMICONDUCTOR COMPONENTS IND LLC0 citations50
US12087677B2Sep 10, 2024
Molded packaging for wide band gap semiconductor devices
SEMICONDUCTOR COMPONENTS IND LLC0 citations49
ST MICROELECTRONICS PTE LTD
6 patentsUS8860207B2Oct 14, 2014
Method of fabricating land grid array semiconductor package
ST MICROELECTRONICS PTE LTD7 citations84
US10429509B2Oct 1, 2019
Molded proximity sensor
ST MICROELECTRONICS PTE LTD1 citations73
US11988743B2May 21, 2024
Molded proximity sensor
ST MICROELECTRONICS PTE LTD0 citations62
US11513220B2Nov 29, 2022
Molded proximity sensor
ST MICROELECTRONICS PTE LTD0 citations62
US11231386B2Jan 25, 2022
Compact microelectronic integrated gas sensor
ST MICROELECTRONICS PTE LTD0 citations62
US9851328B2Dec 26, 2017
Compact microelectronic integrated gas sensor
ST MICROELECTRONICS PTE LTD0 citations52
FAIRCHILD SEMICONDUCTOR
3 patentsST MICROELECTRONICS SA
2 patentsUS7005322B2Feb 28, 2006
Process for encapsulating semiconductor components using through-holes in the semiconductor components support substrates
ST MICROELECTRONICS SA7 citations74
US7358598B2Apr 15, 2008
Process for fabricating a semiconductor package and semiconductor package with leadframe
ST MICROELECTRONICS SA4 citations60
JIN YONGGANG
1 patentTEYSSEYRE JEROME
1 patentST MICROELECTRONICS ASIA
1 patentShowing the top 50 of 54 patents by PatentIndex Score.