Inventor
CHEN CHIA-CHAN
TW35 patents
⚠️ This page may combine multiple inventors who share the name “CHEN CHIA-CHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
34 patentsUS9761623B2Sep 12, 2017
Backside illuminated (BSI) image sensor with a reflector
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US11552205B2Jan 10, 2023
Optical sensing device having inclined reflective surface
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations75
US11398512B2Jul 26, 2022
Photo-sensing device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11380729B2Jul 5, 2022
Image sensor having lens layer and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US10170517B2Jan 1, 2019
Method for forming image sensor device
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations69
US12363459B2Jul 15, 2025
Photosensing pixel including self-aligned light shielding layer
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations64
US12550468B2Feb 10, 2026
Photo-sensing device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12507491B2Dec 23, 2025
Storage node light shield for pixel of image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12317639B2May 27, 2025
Optical sensing device having inclined reflective surface
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12300713B2May 13, 2025
Image sensor having lens layer over optical sensing area and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12218260B2Feb 4, 2025
Optical sensing device having inclined reflective surface
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12113079B2Oct 8, 2024
Image sensor with shallow trench edge doping
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12046614B2Jul 23, 2024
Apparatus and methods for effective impurity gettering
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11735609B2Aug 22, 2023
Image sensor with shallow trench edge doping
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11158591B2Oct 26, 2021
Bond pad structure for bonding improvement
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11139212B2Oct 5, 2021
Semiconductor arrangement and method for making
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10998359B2May 4, 2021
Image sensor with shallow trench edge doping
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10998360B2May 4, 2021
Image sensor with shallow trench edge doping
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11133340B2Sep 28, 2021
Device comprising photodiode and method of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12408456B2Sep 2, 2025
Image sensor pixel and metal shielding of charge storage device of image sensor pixel formed by one step process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations57
US11728362B2Aug 15, 2023
Image sensor pixel and metal shielding of charge storage device of image sensor pixel formed by one step process
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations57
US10734339B2Aug 4, 2020
Bond pad structure for bonding improvement
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10714516B2Jul 14, 2020
Image sensor with shallow trench edge doping
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10672810B2Jun 2, 2020
CMOS image sensor with shallow trench edge doping
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10276524B2Apr 30, 2019
Bond pad structure for bonding improvement
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10014269B2Jul 3, 2018
Method for wafer dicing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9748187B2Aug 29, 2017
Wafer structure and method for wafer dicing
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US10879123B2Dec 29, 2020
Protected chip-scale package (CSP) pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49
US10515989B2Dec 24, 2019
Device comprising photodiode and method of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49
US10510606B2Dec 17, 2019
Protected chip-scale package (CSP) pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49
US10276441B2Apr 30, 2019
Protected chip-scale package (CSP) pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49
US9748150B2Aug 29, 2017
Test line structure and method for performing wafer acceptance test
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations45
US9859325B2Jan 2, 2018
Complementary metal-oxide-semiconductor (CMOS) image sensor with silicon and silicon germanium
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42
US10163952B2Dec 25, 2018
Backside illuminated image sensor device structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations37