Inventor
CHOU KUANG-CHUN
TW6 patents
Patents
6 patentsUS6118176ASep 12, 2000
Stacked chip assembly utilizing a lead frame
ADVANCED SEMICONDUCTOR ENG153 citations96
US6722412B2Apr 20, 2004
Die bonder
ADVANCED SEMICONDUCTOR ENG16 citations82
US6803089B2Oct 12, 2004
Cleaning substrate for cleaning and regenerating a mold
ADVANCED SEMICONDUCTOR ENG2 citations59
US7812431B2Oct 12, 2010
Leadframe with die pad and leads corresponding thereto
ADVANCED SEMICONDUCTOR ENG2 citations54
US6828002B2Dec 7, 2004
Substrate strip with sides having flanges and recesses
ADVANCED SEMICONDUCTOR ENG2 citations52
US7429342B2Sep 30, 2008
Method for cleaning and regenerating a mold
ADVANCED SEMICONDUCTOR ENG0 citations49