P
US7812431B2ActiveUtilityPatentIndex 54

Leadframe with die pad and leads corresponding thereto

Assignee: ADVANCED SEMICONDUCTOR ENGPriority: Jun 6, 2007Filed: Jun 5, 2008Granted: Oct 12, 2010
Est. expiryJun 6, 2027(~0.9 yrs left)· nominal 20-yr term from priority
Inventors:YANG SU-TAICHOU KUANG-CHUNCHENG WEN-CHI
H10W 90/756H10W 74/00H10W 72/07554H10W 72/5449H10W 72/547H10W 70/411
54
PatentIndex Score
2
Cited by
11
References
17
Claims

Abstract

A leadframe includes a die pad and a plurality of leads corresponding to the die pad. The die pad for supporting a die is formed with a plurality of sides, each of the sides having at least one recess portion and at least one protrusion portion. The leads are substantially coplanar to the die pad. The leads include a plurality of first leads and a plurality of second leads. The first leads extend into the recess portions respectively, and the second leads are aligned with the protrusion portions. The length of the first leads is greater than that of the second leads. The length of wires electrically connecting the die to the leads or the die pad can be adjusted by the sides of the leadframe with the recess portion and the protrusion portion having a dimension corresponding to the leads, so as to save the manufacture cost of the leadframe.

Claims

exact text as granted — not AI-modified
1. A leadframe with a die pad and leads corresponding thereto, comprising:
 a die pad, for supporting a die and formed with a plurality of sides, each of the sides having at least one recess portion and at least one protrusion portion; and 
 a plurality of leads, substantially coplanar to the die pad, and having a plurality of first leads and a plurality of second leads, wherein the first leads extend into the recess portions, the second leads are aligned with the protrusion portions, and a length of the first leads is greater than that of the second leads, 
 wherein each of the protrusion portions has a contact region that is electrically connected to the die by a first wire. 
 
     
     
       2. The leadframe according to  claim 1 , wherein the recess portions and the protrusion portions are arranged alternately. 
     
     
       3. The leadframe according to  claim 1 , wherein each of the first leads extends into a recess portion. 
     
     
       4. The leadframe according to  claim 1 , wherein the plurality of first leads extend into a recess portion. 
     
     
       5. The leadframe according to  claim 1 , wherein each of the second leads is aligned with a protrusion portion. 
     
     
       6. The leadframe according to  claim 1 , wherein the plurality of second leads are aligned with a protrusion portion. 
     
     
       7. The leadframe according to  claim 1 , wherein the contact region is used for grounding the die. 
     
     
       8. The leadframe according to  claim 1 , wherein the first leads are electrically connected to the die by a plurality of second wires, the second leads are electrically connected to the die by a plurality of third wires, and a length of the third wires is greater than that of the second wires. 
     
     
       9. A package with a leadframe, comprising:
 a leadframe with a die pad and leads corresponding thereto, comprising:
 a die pad, formed with a plurality of sides, each of the sides having at least one recess portion and at least one protrusion portion; and 
 a plurality of leads, substantially coplanar to the die pad, and having a plurality of first leads and a plurality of second leads, wherein the first leads extend into the recess portions, the second leads are aligned with the protrusion portions, and a length of the first leads is greater than that of the second leads; 
 
 a die, disposed on the die pad; and 
 a plurality of wires, comprising a plurality of first wires, a plurality of second wires, and a plurality of third wires, wherein the first wires electrically connect the protrusion portions and the die, the second wires electrically connect the first leads and the die, and the third wires electrically connect the second leads and the die. 
 
     
     
       10. The package according to  claim 9 , wherein the recess portions and the protrusion portions are arranged alternately. 
     
     
       11. The package according to  claim 9 , wherein each of the first leads extends into a recess portion. 
     
     
       12. The package according to  claim 9 , wherein the plurality of first leads extend into a recess portion. 
     
     
       13. The package according to  claim 9 , wherein each of the second leads is aligned with a protrusion portion. 
     
     
       14. The package according to  claim 9 , wherein the plurality of second leads are aligned with a protrusion portion. 
     
     
       15. The package according to  claim 9 , wherein each of the protrusion portions has a contact region that is electrically connected to the die by the first wires. 
     
     
       16. The package according to  claim 9 , wherein the contact region is used for grounding the die. 
     
     
       17. The package according to  claim 9 , wherein a length of the third wires is greater than that of the first wires, and a length of the third wires is greater than that of the second wires.

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