Inventor
MARTIN KEVIN P
US23 patents
⚠️ This page may combine multiple inventors who share the name “MARTIN KEVIN P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GEORGIA TECH RES INST
13 patentsUS5465009ANov 7, 1995
Processes and apparatus for lift-off and bonding of materials and devices
GEORGIA TECH RES INST130 citations97
US7431796B2Oct 7, 2008
Method and apparatus for low energy electron enhanced etching of substrates in an AC or DC plasma environment
GEORGIA TECH RES INST14 citations92
US6852195B2Feb 8, 2005
Method and apparatus for low energy electron enhanced etching of substrates in an AC or DC plasma environment
GEORGIA TECH RES INST14 citations92
US6785458B2Aug 31, 2004
Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package
GEORGIA TECH RES INST19 citations92
US6258287B1Jul 10, 2001
Method and apparatus for low energy electron enhanced etching of substrates in an AC or DC plasma environment
GEORGIA TECH RES INST33 citations92
US6033587AMar 7, 2000
Method and apparatus for low energy electron enhanced etching and cleaning of substrates in the positive column of a plasma
GEORGIA TECH RES INST41 citations92
US6027663AFeb 22, 2000
Method and apparatus for low energy electron enhanced etching of substrates
GEORGIA TECH RES INST38 citations92
US5917285AJun 29, 1999
Apparatus and method for reducing operating voltage in gas discharge devices
GEORGIA TECH RES INST26 citations92
US5882538AMar 16, 1999
Method and apparatus for low energy electron enhanced etching of substrates
GEORGIA TECH RES INST51 citations92
US6690081B2Feb 10, 2004
Compliant wafer-level packaging devices and methods of fabrication
GEORGIA TECH RES INST44 citations90
US7468558B2Dec 23, 2008
Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof
GEORGIA TECH RES INST7 citations73
US6954576B2Oct 11, 2005
Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package
GEORGIA TECH RES INST9 citations73
US7554347B2Jun 30, 2009
High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use
GEORGIA TECH RES INST4 citations60