Inventor
MURAMATSU SHIGETSUGU
JP29 patents
⚠️ This page may combine multiple inventors who share the name “MURAMATSU SHIGETSUGU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINKO ELECTRIC IND CO
22 patentsUS6465886B1Oct 15, 2002
Semiconductor device having circuit pattern and lands thereon
SHINKO ELECTRIC IND CO56 citations96
US6420664B1Jul 16, 2002
Metal foil having bumps, circuit substrate having the metal foil, and semiconductor device having the circuit substrate
SHINKO ELECTRIC IND CO35 citations92
US6335493B1Jan 1, 2002
Multilayer wiring board
SHINKO ELECTRIC IND CO22 citations92
US6256207B1Jul 3, 2001
Chip-sized semiconductor device and process for making same
SHINKO ELECTRIC IND CO43 citations92
US5943212AAug 24, 1999
Ceramic circuit board and semiconductor device using same
SHINKO ELECTRIC IND CO46 citations92
US6444494B1Sep 3, 2002
Process of packaging a semiconductor device with reinforced film substrate
SHINKO ELECTRIC IND CO15 citations84
US6242799B1Jun 5, 2001
Anisotropic stress buffer and semiconductor device using the same
SHINKO ELECTRIC IND CO18 citations84
US6110755AAug 29, 2000
Method for manufacturing semiconductor device
SHINKO ELECTRIC IND CO19 citations84
US7180182B2Feb 20, 2007
Semiconductor component
SHINKO ELECTRIC IND CO7 citations74
US6455786B1Sep 24, 2002
Wiring board and manufacturing method thereof and semiconductor device
SHINKO ELECTRIC IND CO9 citations74
US6404214B1Jun 11, 2002
Substrate for inspecting electronic device, method of manufacturing substrate, and method of inspecting electronic device
SHINKO ELECTRIC IND CO7 citations74
US6011300AJan 4, 2000
Semiconductor integrated circuit device
SHINKO ELECTRIC IND CO14 citations74
US5904488AMay 18, 1999
Semiconductor integrated circuit device
SHINKO ELECTRIC IND CO12 citations74
US5744224AApr 28, 1998
Board for mounting semiconductor chip
SHINKO ELECTRIC IND CO12 citations74
US9029891B2May 12, 2015
Wiring substrate, light emitting device, and manufacturing method of wiring substrate
SHINKO ELECTRIC IND CO4 citations73
US9000474B2Apr 7, 2015
Wiring substrate, light emitting device, and manufacturing method of wiring substrate
SHINKO ELECTRIC IND CO4 citations73
US6730859B2May 4, 2004
Substrate for mounting electronic parts thereon and method of manufacturing same
SHINKO ELECTRIC IND CO12 citations73
US9084372B2Jul 14, 2015
Wiring substrate, light emitting device, and manufacturing method of wiring substrate
SHINKO ELECTRIC IND CO2 citations63
US7438945B2Oct 21, 2008
Method of producing multilayer interconnection board
SHINKO ELECTRIC IND CO4 citations62
US7183196B2Feb 27, 2007
Multilayer interconnection board and production method thereof
SHINKO ELECTRIC IND CO5 citations62
US8037596B2Oct 18, 2011
Method for manufacturing a wiring board
SHINKO ELECTRIC IND CO4 citations61
US6998291B2Feb 14, 2006
Cost-reducing and process-simplifying wiring board and manufacturing method thereof
SHINKO ELECTRIC IND CO3 citations56
MURAMATSU SHIGETSUGU
6 patentsUS8115300B2Feb 14, 2012
Wiring substrate and manufacturing method thereof, and semiconductor apparatus
MURAMATSU SHIGETSUGU7 citations83
US8835773B2Sep 16, 2014
Wiring board and method of manufacturing the same
MURAMATSU SHIGETSUGU8 citations82
US8222532B2Jul 17, 2012
Method for manufacturing a wiring board
MURAMATSU SHIGETSUGU3 citations60
US8575495B2Nov 5, 2013
Wiring substrate, semiconductor device, and method for manufacturing wiring substrate
MURAMATSU SHIGETSUGU3 citations59
US9741647B2Aug 22, 2017
Wiring substrate, semiconductor device, and method of manufacturing wiring substrate
MURAMATSU SHIGETSUGU1 citations49
US8508050B2Aug 13, 2013
Wiring substrate, semiconductor device, and method for manufacturing wiring substrate
MURAMATSU SHIGETSUGU1 citations48