Wiring substrate, light emitting device, and manufacturing method of wiring substrate

Abstract

There is provided a wiring substrate. The wiring substrate includes: a heat sink; an insulating member on the heat sink; a wiring pattern embedded in the insulating member and including a first surface and a second surface opposite to the first surface, the second surface contacting the insulating member; and a metal layer on the first surface of the wiring pattern, wherein an exposed surface of the metal layer is flush with an exposed surface of the insulating member.

What is claimed is: 
     
       1. A wiring substrate comprising:
 a heat sink; 
 an insulating layer formed on the heat sink; 
 a reflective layer formed on the insulating layer; 
 a wiring pattern having a first main surface, a second main surface, and a side surface, the side surface being covered by the reflective layer; and 
 a metal layer formed on the entire first main surface of the wiring pattern, 
 wherein the insulating layer is in direct contact with the second main surface of the wiring pattern, and 
 wherein the second main surface of the wiring pattern has a mountain shape rising towards the insulating layer. 
 
     
     
       2. The wiring substrate of  claim 1 , wherein a heat conductivity of the insulating layer is higher than that of the reflective layer. 
     
     
       3. A light emitting device comprising:
 the wiring substrate of  claim 1 ; 
 a light emitting element mounted on the wiring substrate; and 
 an encapsulating resin that encapsulates the light emitting element. 
 
     
     
       4. A wiring substrate comprising:
 a heat sink; 
 an insulating layer directly on the heat sink; 
 a reflective layer on the insulating layer; 
 a wiring pattern disposed in a recess portion formed in the reflective layer, the wiring pattern including a first main surface, a second main surface, and a side surface, the side surface and the second main surface being directly covered by the reflective layer; and 
 a metal layer formed on the entire first main surface of the wiring pattern, 
 wherein a surface of the metal layer is flush with an exposed surface of the reflective layer. 
 
     
     
       5. The wiring substrate of  claim 4 , wherein a heat conductivity of the insulating layer is higher than that of the reflective layer. 
     
     
       6. A light emitting device comprising:
 the wiring substrate of  claim 4 ; 
 a light emitting element mounted on the wiring substrate; and 
 an encapsulating resin that encapsulates the light emitting element.