Inventor
PAL ROHIT
US45 patents
⚠️ This page may combine multiple inventors who share the name “PAL ROHIT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GLOBALFOUNDRIES INC
17 patentsUS9362180B2Jun 7, 2016
Integrated circuit having multiple threshold voltages
GLOBALFOUNDRIES INC425 citations98
US9209186B1Dec 8, 2015
Threshold voltage control for mixed-type non-planar semiconductor devices
GLOBALFOUNDRIES INC20 citations92
US7932143B1Apr 26, 2011
Methods for protecting gate stacks during fabrication of semiconductor devices and semiconductor devices fabricated from such methods
GLOBALFOUNDRIES INC32 citations92
US7670934B1Mar 2, 2010
Methods for fabricating MOS devices having epitaxially grown stress-inducing source and drain regions
GLOBALFOUNDRIES INC23 citations92
US9362284B2Jun 7, 2016
Threshold voltage control for mixed-type non-planar semiconductor devices
GLOBALFOUNDRIES INC7 citations84
US8026539B2Sep 27, 2011
Metal oxide semiconductor devices having doped silicon-compromising capping layers and methods for fabricating the same
GLOBALFOUNDRIES INC13 citations84
US7960229B2Jun 14, 2011
Metal oxide semiconductor transistor with reduced gate height, and related fabrication methods
GLOBALFOUNDRIES INC10 citations84
US7939852B2May 10, 2011
Transistor device having asymmetric embedded strain elements and related manufacturing method
GLOBALFOUNDRIES INC10 citations84
US9455201B2Sep 27, 2016
Integration method for fabrication of metal gate based multiple threshold voltage devices and circuits
GLOBALFOUNDRIES INC18 citations83
US9875936B1Jan 23, 2018
Spacer defined fin growth and differential fin width
GLOBALFOUNDRIES INC2 citations71
US8373228B2Feb 12, 2013
Semiconductor transistor device structure with back side source/drain contact plugs, and related manufacturing method
GLOBALFOUNDRIES INC2 citations63
US7763508B2Jul 27, 2010
Methods for protecting gate stacks during fabrication of semiconductor devices and semiconductor devices fabricated from such methods
GLOBALFOUNDRIES INC2 citations62
US9159567B1Oct 13, 2015
Replacement low-K spacer
GLOBALFOUNDRIES INC3 citations60
US7632727B2Dec 15, 2009
Method of forming stepped recesses for embedded strain elements in a semiconductor device
GLOBALFOUNDRIES INC1 citations52
US9349814B2May 24, 2016
Gate height uniformity in semiconductor devices
GLOBALFOUNDRIES INC0 citations50
US9093560B2Jul 28, 2015
Gate height uniformity in semiconductor devices
GLOBALFOUNDRIES INC1 citations50
US7682845B2Mar 23, 2010
Methods for calibrating a process for growing an epitaxial silicon film and methods for growing an epitaxial silicon film
GLOBALFOUNDRIES INC1 citations48
PAL ROHIT
9 patentsUS8148750B2Apr 3, 2012
Transistor device having asymmetric embedded strain elements and related manufacturing method
PAL ROHIT5 citations73
US8293609B2Oct 23, 2012
Method of manufacturing a transistor device having asymmetric embedded strain elements
PAL ROHIT1 citations62
US8217463B2Jul 10, 2012
Methods for protecting gate stacks during fabrication of semiconductor devices and semiconductor devices fabricated from such methods
PAL ROHIT2 citations62
US8664066B2Mar 4, 2014
Formation of a channel semiconductor alloy by forming a nitride based hard mask layer
PAL ROHIT3 citations61
US8445964B2May 21, 2013
Fabrication of semiconductors with high-K/metal gate electrodes
PAL ROHIT2 citations58
US8119464B2Feb 21, 2012
Fabrication of semiconductors with high-K/metal gate electrodes
PAL ROHIT3 citations58
US8664057B2Mar 4, 2014
High-K metal gate electrode structures formed by early cap layer adaptation
PAL ROHIT1 citations52
US8084828B2Dec 27, 2011
Methods for protecting gate stacks during fabrication of semiconductor devices and semiconductor devices fabricated from such methods
PAL ROHIT0 citations51
US8278165B2Oct 2, 2012
Methods for protecting film layers while removing hardmasks during fabrication of semiconductor devices
PAL ROHIT0 citations41
ADVANCED MICRO DEVICES INC
6 patentsUS7534689B2May 19, 2009
Stress enhanced MOS transistor and methods for its fabrication
ADVANCED MICRO DEVICES INC74 citations98
US7767534B2Aug 3, 2010
Methods for fabricating MOS devices having highly stressed channels
ADVANCED MICRO DEVICES INC16 citations92
US7994014B2Aug 9, 2011
Semiconductor devices having faceted silicide contacts, and related fabrication methods
ADVANCED MICRO DEVICES INC11 citations84
US7704840B2Apr 27, 2010
Stress enhanced transistor and methods for its fabrication
ADVANCED MICRO DEVICES INC2 citations63
US7838308B2Nov 23, 2010
Method of controlling embedded material/gate proximity
ADVANCED MICRO DEVICES INC3 citations60
US7893496B2Feb 22, 2011
Stress enhanced transistor
ADVANCED MICRO DEVICES INC1 citations52
UNIV MICHIGAN
2 patentsCARTER RICHARD
2 patentsUS8198192B2Jun 12, 2012
Adjusting threshold voltage for sophisticated transistors by diffusing a gate dielectric cap layer material prior to gate dielectric stabilization
CARTER RICHARD6 citations83
US8525289B2Sep 3, 2013
Adjusting threshold voltage for sophisticated transistors by diffusing a gate dielectric cap layer material prior to gate dielectric stabilization
CARTER RICHARD2 citations62