Inventor

EZAWA HIROKAZU

JP37 patents

⚠️ This page may combine multiple inventors who share the name “EZAWA HIROKAZU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

EZAWA HIROKAZU

TOSHIBA KK

Semiconductor device manufacturing method

Semiconductor device having fan-in and fan-out redistribution layers

Semiconductor device having semiconductor element with copper pad mounted on wiring substrate and method for fabricating the same

Semiconductor integrated circuit device having interposer and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor element and fabricating method thereof

Semiconductor process for forming bump electrodes with tapered sidewalls

Semiconductor device having bump electrodes with a trapezoidal cross-section along one axis

Semiconductor device with bump electrode

Manufacturing method of semiconductor device

Method of manufacturing a semiconductor device having a protruding bump electrode

Semiconductor device having a protruding bump electrode

Method of manufacturing semiconductor device

Method for manufacturing wiring in groove

Semiconductor device and method of manufacturing the same

Apparatus and method of manufacturing semiconductor device

Heating element movement bonding method for semiconductor components

Peripheral processing method and method of manufacturing a semiconductor device

Semiconductor device manufacturing method

Method for making a semiconductor bump electrode with a skirt

Apparatus and method for producing electronic elements

Semiconductor device and method for manufacturing the same

Method of manufacturing semiconductor device and semiconductor device

Semiconductor device having power semiconductor elements

Electroless Ni-B plating liquid, electronic device and method for manufacturing the same

Semiconductor device and manufacturing method thereof

Method of manufacturing a semiconductor device from which damage layers and native oxide films in connection holes have been removed

Semiconductor device and manufacturing method thereof

MIGITA TATSUO

Electronic component and method of connecting with multi-profile bumps

Bump structure with underbump metallization structure and integrated redistribution layer

Semiconductor device and manufacturing method of semiconductor device

Manufacturing method of semiconductor apparatus and semiconductor apparatus

Manufacturing method of semiconductor apparatus and semiconductor apparatus

EBARA CORP

Electroless Ni—B plating liquid, electronic device and method for manufacturing the same

Method for filling small holes or covering small recesses in the surface of substrates

YAMASHITA SOICHI

Manufacturing method of semiconductor device and semiconductor device

HONDA MAKOTO

Method of manufacturing a semiconductor device from which damage layers and native oxide films in connection holes have been removed