P

Inventor

JAN CHIA-HONG

US149 patents
⚠️ This page may combine multiple inventors who share the name “JAN CHIA-HONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

43 patents
US6887762B1May 3, 2005

Method of fabricating a field effect transistor structure with abrupt source/drain junctions

INTEL CORP141 citations99
US6521964B1Feb 18, 2003

Device having spacers for improved salicide resistance on polysilicon gates

INTEL CORP241 citations99
US6509618B2Jan 21, 2003

Device having thin first spacers and partially recessed thick second spacers for improved salicide resistance on polysilicon gates

INTEL CORP239 citations99
US6506652B2Jan 14, 2003

Method of recessing spacers to improved salicide resistance on polysilicon gates

INTEL CORP239 citations99
US6165826ADec 26, 2000

Transistor with low resistance tip and method of fabrication in a CMOS process

INTEL CORP301 citations99
US6765273B1Jul 20, 2004

Device structure and method for reducing silicide encroachment

INTEL CORP240 citations98
US6479391B2Nov 12, 2002

Method for making a dual damascene interconnect using a multilayer hard mask

INTEL CORP88 citations98
US6326664B1Dec 4, 2001

Transistor with ultra shallow tip and method of fabrication

INTEL CORP128 citations98
US5908313AJun 1, 1999

Method of forming a transistor

INTEL CORP297 citations98
US5710450AJan 20, 1998

Transistor with ultra shallow tip and method of fabrication

INTEL CORP199 citations98
US6235568B1May 22, 2001

Semiconductor device having deposited silicon regions and a method of fabrication

INTEL CORP303 citations97
US6198142B1Mar 6, 2001

Transistor with minimal junction capacitance and method of fabrication

INTEL CORP85 citations97
US7682916B2Mar 23, 2010

Field effect transistor structure with abrupt source/drain junctions

INTEL CORP31 citations96
US7436035B2Oct 14, 2008

Method of fabricating a field effect transistor structure with abrupt source/drain junctions

INTEL CORP36 citations96
US7338873B2Mar 4, 2008

Method of fabricating a field effect transistor structure with abrupt source/drain junctions

INTEL CORP28 citations96
US6121100ASep 19, 2000

Method of fabricating a MOS transistor with a raised source/drain extension

INTEL CORP147 citations96
US6777759B1Aug 17, 2004

Device structure and method for reducing silicide encroachment

INTEL CORP58 citations95
US6518155B1Feb 11, 2003

Device structure and method for reducing silicide encroachment

INTEL CORP43 citations95
US5891809AApr 6, 1999

Manufacturable dielectric formed using multiple oxidation and anneal steps

INTEL CORP92 citations95
US7115502B2Oct 3, 2006

Structure and manufacturing process of localized shunt to reduce electromigration failure of copper dual damascene process

INTEL CORP17 citations93
US7943468B2May 17, 2011

Penetrating implant for forming a semiconductor device

INTEL CORP20 citations92
US7541239B2Jun 2, 2009

Selective spacer formation on transistors of different classes on the same device

INTEL CORP26 citations92
US6777760B1Aug 17, 2004

Device with recessed thin and thick spacers for improved salicide resistance on polysilicon gates

INTEL CORP13 citations92
US6593633B2Jul 15, 2003

Method and device for improved salicide resistance on polysilicon gates

INTEL CORP16 citations92
US6188117B1Feb 13, 2001

Method and device for improved salicide resistance on polysilicon gates

INTEL CORP16 citations92
US6703672B1Mar 9, 2004

Polysilicon/amorphous silicon composite gate electrode

INTEL CORP16 citations91
US6017819AJan 25, 2000

Method for forming a polysilicon/amorphous silicon composite gate electrode

INTEL CORP18 citations91
US6114722ASep 5, 2000

Microcrystalline silicon structure and fabrication process

INTEL CORP20 citations89
US5885884AMar 23, 1999

Process for fabricating a microcrystalline silicon structure

INTEL CORP23 citations89
US11335601B2May 17, 2022

Non-planar I/O and logic semiconductor devices having different workfunction on common substrate

INTEL CORP6 citations85
US10096599B2Oct 9, 2018

Methods of integrating multiple gate dielectric transistors on a tri-gate (finFET) process

INTEL CORP7 citations84
US9972642B2May 15, 2018

High voltage three-dimensional devices having dielectric liners

INTEL CORP5 citations84
US9929090B2Mar 27, 2018

Antifuse element using spacer breakdown

INTEL CORP7 citations84
US9899472B2Feb 20, 2018

Dielectric and isolation lower fin material for fin-based electronics

INTEL CORP4 citations84
US9786783B2Oct 10, 2017

Transistor architecture having extended recessed spacer and source/drain regions and method of making same

INTEL CORP16 citations84
US8681573B2Mar 25, 2014

Programmable/re-programmable device in high-k metal gate MOS

INTEL CORP5 citations84
US10892192B2Jan 12, 2021

Non-planar I/O and logic semiconductor devices having different workfunction on common substrate

INTEL CORP5 citations83
US10692771B2Jun 23, 2020

Non-planar I/O and logic semiconductor devices having different workfunction on common substrate

INTEL CORP4 citations83
US10312367B2Jun 4, 2019

Monolithic integration of high voltage transistors and low voltage non-planar transistors

INTEL CORP12 citations83
US10229853B2Mar 12, 2019

Non-planar I/O and logic semiconductor devices having different workfunction on common substrate

INTEL CORP4 citations83
US10115721B2Oct 30, 2018

Planar device on fin-based transistor architecture

INTEL CORP5 citations83
US9356023B2May 31, 2016

Planar device on fin-based transistor architecture

INTEL CORP5 citations83
US10204999B2Feb 12, 2019

Transistor with airgap spacer

INTEL CORP8 citations82

HAFEZ WALID M

4 patents

WISCONSIN ALUMNI RES FOUND

1 patent

MURTHY ANAND S

1 patent

YEH JENG-YA D

1 patent

Showing the top 50 of 149 patents by PatentIndex Score.