Inventor
GHANI TAHIR
US533 patents
⚠️ This page may combine multiple inventors who share the name “GHANI TAHIR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
29 patentsUS6885084B2Apr 26, 2005
Semiconductor transistor having a stressed channel
INTEL CORP159 citations99
US6861318B2Mar 1, 2005
Semiconductor transistor having a stressed channel
INTEL CORP165 citations99
US6621131B2Sep 16, 2003
Semiconductor transistor having a stressed channel
INTEL CORP534 citations99
US6521964B1Feb 18, 2003
Device having spacers for improved salicide resistance on polysilicon gates
INTEL CORP241 citations99
US6509618B2Jan 21, 2003
Device having thin first spacers and partially recessed thick second spacers for improved salicide resistance on polysilicon gates
INTEL CORP239 citations99
US6506652B2Jan 14, 2003
Method of recessing spacers to improved salicide resistance on polysilicon gates
INTEL CORP239 citations99
US7402872B2Jul 22, 2008
Method for forming an integrated circuit
INTEL CORP141 citations98
US9466565B2Oct 11, 2016
Self-aligned contacts
INTEL CORP24 citations97
US10304940B1May 28, 2019
Gate cut and fin trim isolation for advanced integrated circuit structure fabrication
INTEL CORP13 citations96
US6121100ASep 19, 2000
Method of fabricating a MOS transistor with a raised source/drain extension
INTEL CORP147 citations96
US10886217B2Jan 5, 2021
Integrated circuit device with back-side interconnection to deep source/drain semiconductor
INTEL CORP20 citations94
US6020244AFeb 1, 2000
Channel dopant implantation with automatic compensation for variations in critical dimension
INTEL CORP75 citations94
US10615265B2Apr 7, 2020
Gate cut and fin trim isolation for advanced integrated circuit structure fabrication
INTEL CORP8 citations93
US9882027B2Jan 30, 2018
Confined epitaxial regions for semiconductor devices and methods of fabricating semiconductor devices having confined epitaxial regions
INTEL CORP12 citations93
US9859368B2Jan 2, 2018
Integration methods to fabricate internal spacers for nanowire devices
INTEL CORP11 citations93
US9831306B2Nov 28, 2017
Self-aligned gate edge and local interconnect and method to fabricate same
INTEL CORP29 citations93
US9722023B2Aug 1, 2017
Selective germanium P-contact metalization through trench
INTEL CORP9 citations93
US9627384B2Apr 18, 2017
Transistors with high concentration of boron doped germanium
INTEL CORP12 citations93
US9484432B2Nov 1, 2016
Contact resistance reduction employing germanium overlayer pre-contact metalization
INTEL CORP14 citations93
US9349810B2May 24, 2016
Selective germanium P-contact metalization through trench
INTEL CORP17 citations93
US9041146B2May 26, 2015
Logic chip including embedded magnetic tunnel junctions
INTEL CORP30 citations93
US7492017B2Feb 17, 2009
Semiconductor transistor having a stressed channel
INTEL CORP18 citations93
US11031487B2Jun 8, 2021
Contact over active gate structures for advanced integrated circuit structure fabrication
INTEL CORP7 citations92
US10541316B2Jan 21, 2020
Contact over active gate structures for advanced integrated circuit structure fabrication
INTEL CORP9 citations92
US10460993B2Oct 29, 2019
Fin cut and fin trim isolation for advanced integrated circuit structure fabrication
INTEL CORP6 citations92
US9508821B2Nov 29, 2016
Self-aligned contacts
INTEL CORP13 citations92
US7732285B2Jun 8, 2010
Semiconductor device having self-aligned epitaxial source and drain extensions
INTEL CORP41 citations92
US6800887B1Oct 5, 2004
Nitrogen controlled growth of dislocation loop in stress enhanced transistor
INTEL CORP17 citations92
US6777760B1Aug 17, 2004
Device with recessed thin and thick spacers for improved salicide resistance on polysilicon gates
INTEL CORP13 citations92
GLASS GLENN A
5 patentsUS9117791B2Aug 25, 2015
Selective germanium P-contact metalization through trench
GLASS GLENN A38 citations98
US9728464B2Aug 8, 2017
Self-aligned 3-D epitaxial structures for MOS device fabrication
GLASS GLENN A28 citations94
US9153583B2Oct 6, 2015
III-V layers for N-type and P-type MOS source-drain contacts
GLASS GLENN A28 citations94
US8994104B2Mar 31, 2015
Contact resistance reduction employing germanium overlayer pre-contact metalization
GLASS GLENN A41 citations94
US9059024B2Jun 16, 2015
Self-aligned contact metallization for reduced contact resistance
GLASS GLENN A25 citations92
BOHR MARK T
3 patentsKIM SEIYON
3 patentsCAPPELLANI ANNALISA
3 patentsUS8313999B2Nov 20, 2012
Multi-gate semiconductor device with self-aligned epitaxial source and drain
CAPPELLANI ANNALISA70 citations97
US9608059B2Mar 28, 2017
Semiconductor device with isolated body portion
CAPPELLANI ANNALISA18 citations92
US8735869B2May 27, 2014
Strained gate-all-around semiconductor devices formed on globally or locally isolated substrates
CAPPELLANI ANNALISA22 citations92
MURTHY ANAND S
2 patentsCEA STEPHEN M
2 patentsGOLONZKA OLEG
1 patentPETHE ABHIJIT JAYANT
1 patentNIKONOV DMITRI E
1 patentShowing the top 50 of 533 patents by PatentIndex Score.