Inventor
PERNG BAW-CHING
TW32 patents
⚠️ This page may combine multiple inventors who share the name “PERNG BAW-CHING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
22 patentsUS7354847B2Apr 8, 2008
Method of trimming technology
TAIWAN SEMICONDUCTOR MFG528 citations99
US7176137B2Feb 13, 2007
Method for multiple spacer width control
TAIWAN SEMICONDUCTOR MFG101 citations98
US7012027B2Mar 14, 2006
Zirconium oxide and hafnium oxide etching using halogen containing chemicals
TAIWAN SEMICONDUCTOR MFG44 citations92
US6943077B2Sep 13, 2005
Selective spacer layer deposition method for forming spacers with different widths
TAIWAN SEMICONDUCTOR MFG24 citations92
US6498067B1Dec 24, 2002
Integrated approach for controlling top dielectric loss during spacer etching
TAIWAN SEMICONDUCTOR MFG51 citations91
US7122484B2Oct 17, 2006
Process for removing organic materials during formation of a metal interconnect
TAIWAN SEMICONDUCTOR MFG19 citations90
US7172933B2Feb 6, 2007
Recessed polysilicon gate structure for a strained silicon MOSFET device
TAIWAN SEMICONDUCTOR MFG34 citations89
US7081413B2Jul 25, 2006
Method and structure for ultra narrow gate
TAIWAN SEMICONDUCTOR MFG16 citations84
US6746900B1Jun 8, 2004
Method for forming a semiconductor device having high-K gate dielectric material
TAIWAN SEMICONDUCTOR MFG17 citations84
US6955984B2Oct 18, 2005
Surface treatment of metal interconnect lines
TAIWAN SEMICONDUCTOR MFG12 citations81
US6479403B1Nov 12, 2002
Method to pattern polysilicon gates with high-k material gate dielectric
TAIWAN SEMICONDUCTOR MFG15 citations79
US7271103B2Sep 18, 2007
Surface treated low-k dielectric as diffusion barrier for copper metallization
TAIWAN SEMICONDUCTOR MFG8 citations74
US7037849B2May 2, 2006
Process for patterning high-k dielectric material
TAIWAN SEMICONDUCTOR MFG7 citations74
US6812044B2Nov 2, 2004
Advanced control for plasma process
TAIWAN SEMICONDUCTOR MFG7 citations74
US6838381B2Jan 4, 2005
Methods for improving sheet resistance of silicide layer after removal of etch stop layer
TAIWAN SEMICONDUCTOR MFG11 citations71
US7378308B2May 27, 2008
CMOS devices with improved gap-filling
TAIWAN SEMICONDUCTOR MFG4 citations63
US7148114B2Dec 12, 2006
Process for patterning high-k dielectric material
TAIWAN SEMICONDUCTOR MFG2 citations63
US8053894B2Nov 8, 2011
Surface treatment of metal interconnect lines
TAIWAN SEMICONDUCTOR MFG3 citations62
US6969688B2Nov 29, 2005
Wet etchant composition and method for etching HfO2 and ZrO2
TAIWAN SEMICONDUCTOR MFG5 citations58
US7208331B2Apr 24, 2007
Methods and structures for critical dimension and profile measurement
TAIWAN SEMICONDUCTOR MFG0 citations52
US7011929B2Mar 14, 2006
Method for forming multiple spacer widths
TAIWAN SEMICONDUCTOR MFG0 citations42
US7400401B2Jul 15, 2008
Measuring low dielectric constant film properties during processing
TAIWAN SEMICONDUCTOR MFG0 citations41