Inventor

WU CHI-CHUAN

TW35 patents

⚠️ This page may combine multiple inventors who share the name “WU CHI-CHUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WU CHI-CHUAN

SILICONWARE PRECISION INDUSTRIES CO LTD

Crack-preventive semiconductor package

Flip chip type quad flat non-leaded package

Flip-chip semiconductor package with lead frame as chip carrier and fabrication method thereof

Semiconductor package and fabricating method thereof

Semiconductor package with heat-dissipating structure and method of making the same

Stacked-die package structure

Multiple stacked-chip packaging structure

Multi-chip packaging structure

Lead frame and flip chip semiconductor package with the same

Method of fabricating a thin and fine ball-grid array package with embedded heat spreader

Integration of heat conducting apparatus and chip carrier in IC package

Method of singulating a batch of integrated circuit package units constructed on a single matrix base

Semiconductor package with heat dissipating structure

Method of fabricating a thin and fine ball-grid array package with embedded heat spreader

Method of fabricating a thin and fine ball-grid array package with embedded heat spreader

Method of fabricating a thin and fine ball-grid array package with embedded heat spreader

Method of fabricating a thin and fine ball-grid array package with embedded heat spreader

Semiconductor package having vertically mounted passive devices under a chip and a fabricating method thereof

Semiconductor package with heat-dissipating structure and method of making the same

Super low profile package with stacked dies

Method of mounting a passive component over an integrated circuit package substrate

Stacked multi-chip package structure with on-chip integration of passive component

Multi-chip module package structure

Wafer level packaging process of semiconductor

Tape carrier package structure with dummy pads and dummy leads for package reinforcement

Flip-chip semiconductor package with lead frame and method for fabricating the same

Heat sink with collapse structure and semiconductor package with heat sink

Method of mounting an exposed-pad type of semiconductor device over a printed circuit board

Method of fabricating a thin and fine ball-grid array package with embedded heat spreader

Package structure for accommodating thicker semiconductor unit

IC package structure for achieving better heat dissipation

Heat sink with collapse structure for semiconductor package

Method of packaging multi chip module

Method for fabricating flip-chip semiconductor package with lead frame as chip carrier

SILICON PREC IND CO LTD

Package structure stacking chips on front surface and back surface of substrate