Heat sink with collapse structure for semiconductor package

Abstract

A heat sink with a collapse structure and a semiconductor device with the heat sink are proposed, in which the heat sink is in ladder-like shape due to a height difference formed between an extending portion and an body of the heat sink, and the body has at least one surface exposed to outside of the semiconductor package. The extending portion produces collapse deformation in response to stress from engagement of molds in a molding process, so as to prevent a semiconductor chip from being damaged by the stress. The heat sink directly attached to the chip allows heat generated by the chip to pass through the extending portion to the body of the heat sink, and then the heat can be dissipated through the exposed surface of the body to the outside of the semiconductor package, so as to improve the heat dissipating efficiency.

1. A heat sink with a collapse structure, comprising:
 a body having at least one surface exposed to outside of an encapsulant of a semiconductor package;  
 one or more extending portions extending inwardly from a bottom surface of the body and then bending downwardly to a position for attaching a semiconductor chip thereto, such that the heat sink is in a ladder shape due to a height difference formed between the extending portion and the body; and  
 a connecting part formed with a via by connecting ends of the extending portions of the heat sink.  
 
     
     
       2. The heat sink of  claim 1 , wherein the heat sink is formed with a ladder-shaped portion having a height difference with respect to the body, and at least one independently extending portion extending inwardly from the ladder-shaped portion. 
     
     
       3. The heat sink of  claim 2 , wherein at least one ladder-shaped recess is formed at side edges on the exposed surface of the heat sink. 
     
     
       4. The heat sink of  claim 2 , wherein a spacing means is formed respectively between two sides of the extending portion and the ladder-shaped portion. 
     
     
       5. The heat sink of  claim 4 , wherein at least one ladder-shaped recess is formed at side edges on the exposed surface of the heat sink. 
     
     
       6. The heat sink of  claim 1 , wherein at least one ladder-shaped recess is formed at side edges on the exposed surface of the heat sink.