Inventor · disambiguated record
Chi-Chuan Wu
Also filed as: WU CHI-CHUAN
35 granted patents·3 pending applications·1,930 citations·filing 1999–2007
98Inventor score
Technology areasH10W
Top patents by PatentIndex Score
38 records- 0198US6590281B2Crack-preventive semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Jul 8, 2003·179 cites·8 claims
- 0298US6507120B2Flip chip type quad flat non-leaded packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Jan 14, 2003·241 cites·21 claims
- 0397US6593662B1Stacked-die package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Jul 15, 2003·203 cites·26 claims
- 0495US6414384B1Package structure stacking chips on front surface and back surface of substrateSILICON PREC IND CO LTD·Filed 2000·Granted Jul 2, 2002·131 cites·20 claims
- 0594US6764880B2Semiconductor package and fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Jul 20, 2004·83 cites·10 claims
- 0694US6555902B2Multiple stacked-chip packaging structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Apr 29, 2003·91 cites·15 claims
- 0793US7274088B2Flip-chip semiconductor package with lead frame as chip carrier and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Sep 25, 2007·69 cites·8 claims
- 0893US6602737B2Semiconductor package with heat-dissipating structure and method of making the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Aug 5, 2003·75 cites·9 claims
- 0993US6541310B1Method of fabricating a thin and fine ball-grid array package with embedded heat spreaderSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Apr 1, 2003·61 cites·8 claims
- 1091US6661087B2Lead frame and flip chip semiconductor package with the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Dec 9, 2003·69 cites·14 claims
- 1190US6507098B1Multi-chip packaging structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Jan 14, 2003·121 cites·11 claims
- 1290US6472743B2Semiconductor package with heat dissipating structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Oct 29, 2002·74 cites·15 claims
- 1390US6281047B1Method of singulating a batch of integrated circuit package units constructed on a single matrix baseSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Aug 28, 2001·59 cites·9 claims
- 1490US6282096B1Integration of heat conducting apparatus and chip carrier in IC packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Aug 28, 2001·60 cites·17 claims
- 1588US6611434B1Stacked multi-chip package structure with on-chip integration of passive componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Aug 26, 2003·52 cites·8 claims
- 1685US6281578B1Multi-chip module package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Aug 28, 2001·42 cites·9 claims
- 1781US6781222B2Semiconductor package having vertically mounted passive devices under a chip and a fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Aug 24, 2004·34 cites·20 claims
- 1881US6673690B2Method of mounting a passive component over an integrated circuit package substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Jan 6, 2004·32 cites·4 claims
- 1980US6951776B2Method of fabricating a thin and fine ball-grid array package with embedded heat spreaderSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Oct 4, 2005·19 cites·8 claims
- 2078US6713850B1Tape carrier package structure with dummy pads and dummy leads for package reinforcementSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Mar 30, 2004·34 cites·12 claims
- 2175US6753602B2Semiconductor package with heat-dissipating structure and method of making the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Jun 22, 2004·18 cites·11 claims
- 2275US6731015B2Super low profile package with stacked diesSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted May 4, 2004·23 cites·16 claims
- 2374US6949413B2Method of fabricating a thin and fine ball-grid array package with embedded heat spreaderSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Sep 27, 2005·13 cites·8 claims
- 2473US7045395B2Method of fabricating a thin and fine ball-grid array package with embedded heat spreaderSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted May 16, 2006·12 cites·9 claims
- 2573US6933175B2Method of fabricating a thin and fine ball-grid array package with embedded heat spreaderSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Aug 23, 2005·12 cites·8 claims
- 2672US6242283B1Wafer level packaging process of semiconductorSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Jun 5, 2001·41 cites·20 claims
- 2769US6538321B2Heat sink with collapse structure and semiconductor package with heat sinkSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Mar 25, 2003·14 cites·10 claims
- 2864US7170168B2Flip-chip semiconductor package with lead frame and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Jan 30, 2007·11 cites·16 claims
- 2964US6949414B2Method of fabricating a thin and fine ball-grid array package with embedded heat spreaderSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Sep 27, 2005·7 cites·8 claims
- 3060US7781264B2Method for fabricating flip-chip semiconductor package with lead frame as chip carrierSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Granted Aug 24, 2010·1 cites·7 claims
- 3160US6798054B1Method of packaging multi chip moduleSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Sep 28, 2004·12 cites·15 claims
- 3260US6495910B1Package structure for accommodating thicker semiconductor unitSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Dec 17, 2002·9 cites·20 claims
- 3358US6858931B2Heat sink with collapse structure for semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Feb 22, 2005·7 cites·6 claims
- 3457US6455355B1Method of mounting an exposed-pad type of semiconductor device over a printed circuit boardSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Sep 24, 2002·14 cites·5 claims
- 3556US6353256B1IC package structure for achieving better heat dissipationSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Mar 5, 2002·7 cites·20 claims
- 3636US2002071935A1Passive element solder pad free of solder ballFiled 2001·Application pending·0 cites
- 3736US2002094602A1DCA memory module and a fabrication method thereofFiled 2001·Application pending·0 cites
- 3832US2002105789A1Semiconductor package for multi-chip stacksSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →