Inventor

LIU CHENGLIN

CN59 patents

⚠️ This page may combine multiple inventors who share the name “LIU CHENGLIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIU CHENGLIN

TENCENT TECH SHENZHEN CO LTD

Method, server, and storage medium for verifying transactions using a smart card

Method and device for controlling peripheral devices via a social networking platform

Method and device for controlling peripheral devices via a social networking platform

Method and device for controlling peripheral devices via a social networking platform

Method and device for controlling peripheral devices via a social networking platform

Input device and control system

Methods and systems for enabling communication with a receiver device in a network

Method and device for controlling peripheral devices via a social networking platform

Method and device for controlling peripheral devices via a social networking platform

Method and device for controlling peripheral devices via a social networking platform

Intercommunication methods and devices based on digital networks

Method, server, and storage medium for verifying transactions using a smart card

Method and device for controlling peripheral devices via a social networking platform

Method and system for encrypted communications

Method and system for encrypted communications

Method, user terminal, and service terminal for processing service data

Data communication via data packet headers

Methods and systems for enabling communication with a receiver device in a network

Data communication via data packet headers

Method, user terminal, and service terminal for processing service data

MARVELL INT LTD

Semiconductor package

Semiconductor package

Thermal solution for drive systems such as hard disk drives and digital versatile discs

Thermal solution for drive systems such as hard disk drives and digital versatile discs

Etched hybrid die package

Die-to-die wire-bonding

Thermal solution for drive systems such as hard disk drives and digital versatile discs

Thermal solution for drive systems such as hard disk drives and digital versatile discs

Placing heat sink into packaging by strip formation assembly

Ball grid array package with laser vias and methods for making the same

MARVELL WORLD TRADE LTD

Thermal enhanced package

Semiconductor packaging with internal wiring bus

Dual row quad flat no-lead semiconductor package

Ball grid array package substrate with through holes and method of forming same

Dual row quad flat no-lead semiconductor package

Chip on leads

LIU CHENGLIN

Etched hybrid die package

Ball grid array package with laser vias and methods for making the same

Semiconductor packaging with internal wiring bus

Thermal solution for drive systems such as hard disk drives and digital versatile discs

Thermal enhanced package

Chip on leads

REALSEE BEIJING TECH CO LTD

Method for merging multiple images and post-processing of panorama

Method and device for generating virtual reality data

LIOU SHIANN-MING

Semiconductor package

CHEN CHENDER

Placing heat sink into packaging by strip formation assembly

MARVELL ASIA PTE LTD

Heat sink design for flip chip ball grid array

MARVELL INT TECHNOLOGY LTD

Thermal enhanced package

KE COM BEIJING TECH CO LTD

Method and device for generating virtual reality data

BEIJING SENSETIME TECH DEVELOPMENT CO LTD

Method and apparatus for generating target neural network structure, electronic device, and storage medium