Inventor
LIN CHENG-NAN
TW31 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHENG-NAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
14 patentsUS9269673B1Feb 23, 2016
Semiconductor device packages
ADVANCED SEMICONDUCTOR ENG43 citations93
US9190367B1Nov 17, 2015
Semiconductor package structure and semiconductor process
ADVANCED SEMICONDUCTOR ENG14 citations84
US9871005B2Jan 16, 2018
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG8 citations83
US9653407B2May 16, 2017
Semiconductor device packages
ADVANCED SEMICONDUCTOR ENG12 citations76
US11316274B2Apr 26, 2022
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG2 citations72
US10784208B2Sep 22, 2020
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG6 citations72
US10431554B2Oct 1, 2019
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG2 citations72
US11037891B2Jun 15, 2021
Device package
ADVANCED SEMICONDUCTOR ENG3 citations71
US12218077B2Feb 4, 2025
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG0 citations62
US10950530B2Mar 16, 2021
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US12119312B2Oct 15, 2024
Device package
ADVANCED SEMICONDUCTOR ENG0 citations61
US11705412B2Jul 18, 2023
Device package
ADVANCED SEMICONDUCTOR ENG0 citations61
US11152315B2Oct 19, 2021
Electronic device package and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations61
US11329017B2May 10, 2022
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations50
TAIWAN SEMICONDUCTOR MFG CO LTD
6 patentsUS12288730B2Apr 29, 2025
Semiconductor device, semiconductor package, and methods of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11901256B2Feb 13, 2024
Semiconductor device, semiconductor package, and methods of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12532738B2Jan 20, 2026
Chip package structure with heat conductive layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US11450588B2Sep 20, 2022
Method for forming chip package structure with heat conductive layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US12476166B2Nov 18, 2025
Inverted trapezoidal heat dissipating solder structure and method of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12581935B2Mar 17, 2026
Stacked via structures and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49
UNITED MICROELECTRONICS CORP
4 patentsUS6521910B1Feb 18, 2003
Structure of a test key for monitoring salicide residue
UNITED MICROELECTRONICS CORP34 citations92
US6363005B1Mar 26, 2002
Method of increasing operating speed of SRAM
UNITED MICROELECTRONICS CORP13 citations69
US6656753B2Dec 2, 2003
Method and structure for measuring bridge induced by mask layout amendment
UNITED MICROELECTRONICS CORP2 citations62
US6559476B2May 6, 2003
Method and structure for measuring bridge induced by mask layout amendment
UNITED MICROELECTRONICS CORP3 citations62
RAYDIUM SEMICONDUCTOR CORP
3 patentsUS11158685B2Oct 26, 2021
Organic light-emitting diode touch display operating method
RAYDIUM SEMICONDUCTOR CORP2 citations68
US9640476B2May 2, 2017
Driving circuit and pin output order arranging method
RAYDIUM SEMICONDUCTOR CORP0 citations41
US10163400B2Dec 25, 2018
Display driving apparatus
RAYDIUM SEMICONDUCTOR CORP0 citations34