Inventor

LIN CHANG-FU

TW70 patents

⚠️ This page may combine multiple inventors who share the name “LIN CHANG-FU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN CHANG-FU

SILICONWARE PRECISION INDUSTRIES CO LTD

Chip carrier for semiconductor chip

Packaging substrate and electronic package having the same

Semiconductor package with heat dissipating structure

Semiconductor package with heat sink attached to substrate

Electronic package and manufacturing method thereof

Heat-dissipating structure and heat-dissipating semiconductor package having the same

Heat dissipating structure and semiconductor package with the same

Semiconductor package with heat sink

Semiconductor package with heat sink

Method for fabricating electronic package

Semiconductor package with heat sink

Electronic package and fabrication method thereof

Electronic package carrier structure thereof, and method for fabricating the carrier structure

Electronic package and manufacturing method thereof

Substrate structure with filling material formed in concave portion

Electronic package and method for fabricating the same

Electronic package and method for fabricating the same

Electronic package and method for fabricating the same

Package substrate and structure

Semiconductor device and fabrication method thereof and semiconductor structure

Electronic package and carrier thereof and method for manufacturing the same

Electronic package and method for fabricating the same

Electronic package and method for fabricating the same

Electronic package

Substrate construction and electronic package including the same

Electronic package and manufacturing method thereof

Electronic package and manufacturing method thereof

Electronic package and manufacturing method thereof

Electronic package and fabrication method thereof

Electronic package, heat dissipation structure and manufacturing method thereof

Method of manufacturing substrate structure with filling material formed in concave portion

Electronic package and manufacturing method thereof

Method for fabricating carrier structure

Flip-chip process and bonding equipment

Electronic package and manufacturing method thereof

Electronic package, manufacturing method thereof and conductive structure

Electronic package and manufacturing method thereof

Method for fabricating electronic package

Electronic package, method for fabricating the same, and heat dissipator

Fabrication method of semiconductor package

Electronic package and carrier thereof and method for manufacturing the same

Method for fabricating electronic package

Electronic package and substrate structure having chamfers

MEDIATEK INC

Embedded system with instruction prefetching device, and method for fetching instructions in embedded systems

Embedded system with instruction prefetching device, and method for fetching instructions in embedded systems

General purpose interface controller of resoure limited system

SILICON INTEGRATED SYS CORP

Apparatus and system for multi-stage event synchronization

Method and apparatus for transmitting registered data onto a PCI bus

HUANG WEN-HOME

Semiconductor package and fabrication method thereof

LIN CHANG-FU

Apparatuses for capturing and storing real-time images