Inventor
WU PAUL YING-FUNG
US29 patents
⚠️ This page may combine multiple inventors who share the name “WU PAUL YING-FUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
JONETIX CORP
14 patentsUS9635011B1Apr 25, 2017
Encryption and decryption techniques using shuffle function
JONETIX CORP117 citations98
US10891366B1Jan 12, 2021
Secure hardware signature and related methods and applications
JONETIX CORP41 citations97
US10021085B1Jul 10, 2018
Encryption and decryption techniques using shuffle function
JONETIX CORP21 citations93
US10931658B2Feb 23, 2021
Encryption and decryption techniques using shuffle function
JONETIX CORP4 citations83
US10419416B2Sep 17, 2019
Encryption and decryption techniques using shuffle function
JONETIX CORP6 citations83
US10263779B2Apr 16, 2019
Secure communications using loop-based authentication flow
JONETIX CORP12 citations83
US12081531B2Sep 3, 2024
Secure communications using loop-based authentication flow
JONETIX CORP1 citations72
US11595368B2Feb 28, 2023
Secure communications using loop-based authentication flow
JONETIX CORP1 citations72
US11516201B2Nov 29, 2022
Encryption and decryption techniques using shuffle function
JONETIX CORP2 citations72
US10742622B2Aug 11, 2020
Secure communications using loop-based authentication flow
JONETIX CORP1 citations72
US12069038B2Aug 20, 2024
Encryption and decryption techniques using shuffle function
JONETIX CORP0 citations62
US12032676B2Jul 9, 2024
Secure hardware signature and related methods and applications
JONETIX CORP0 citations62
US11544371B2Jan 3, 2023
Secure hardware signature and related methods and applications
JONETIX CORP0 citations62
US12524578B2Jan 13, 2026
Processor architecture and related techniques
JONETIX CORP0 citations51
XILINX INC
11 patentsUS7378733B1May 27, 2008
Composite flip-chip package with encased components and method of fabricating same
XILINX INC112 citations97
US7098542B1Aug 29, 2006
Multi-chip configuration to connect flip-chips to flip-chips
XILINX INC95 citations97
US7696006B1Apr 13, 2010
Composite flip-chip package with encased components and method of fabricating same
XILINX INC44 citations96
US7511299B1Mar 31, 2009
Packaged integrated circuit with raised test points
XILINX INC28 citations92
US7345507B1Mar 18, 2008
Multi-product die configurable as two or more programmable integrated circuits of different logic capacities
XILINX INC27 citations91
US7012326B1Mar 14, 2006
Lid and method of employing a lid on an integrated circuit
XILINX INC22 citations91
US7605460B1Oct 20, 2009
Method and apparatus for a power distribution system
XILINX INC18 citations83
US7498192B1Mar 3, 2009
Methods of providing a family of related integrated circuits of different sizes
XILINX INC11 citations83
US7491576B1Feb 17, 2009
Yield-enhancing methods of providing a family of scaled integrated circuits
XILINX INC10 citations82
US7429501B1Sep 30, 2008
Lid and method of employing a lid on an integrated circuit
XILINX INC10 citations82
US7020858B1Mar 28, 2006
Method and apparatus for producing a packaged integrated circuit
XILINX INC1 citations52