Lid and method of employing a lid on an integrated circuit

Abstract

A lid having a plurality of recesses at the edges of the lid to provide an improved adhesive bond between the lid and a substrate of an integrated circuit is disclosed. The plurality of recesses may be a castellation comprising a collection of semi-circular cuts into the originally straight edges of the lid. The castellation can be formed by stamping, etching, molding design, or milling/drilling, all of which are well-known methods in the art of forming lids for integrated circuits. The castellation can be vertically straight or it can be slightly tapered, to provide a better locking of the lid on to the package. Epoxy in the recesses can provide an epoxy post for locking the lid. Method of forming a lid having a plurality of recesses and employing a lid on an integrated circuit are also disclosed.

1. A method of forming a lid for an integrated circuit, said method comprising the steps of:
 forming a recessed portion within a plurality of sides and a top of said lid for receiving a die of said integrated circuit; 
 creating a foot portion of said plurality of sides around said recessed portion and extending a width from said recessed portion; and 
 providing a plurality of recesses at external edges of said foot portion, each recess of said plurality of recesses comprising a beveled edge extending inward from an outer wall of a side of said lid and from said foot portion to said top of said lid, leaving said foot portion with a reduced width at said plurality of recesses. 
 
   
   
     2. The method of  claim 1  wherein said step of creating a foot portion comprises creating a planar surface adapted to be attached to a substrate of an integrated circuit. 
   
   
     3. The method of  claim 1  wherein said step of providing a plurality of recesses at the edges of said foot portion comprises creating recesses having beveled edges. 
   
   
     4. The method of  claim 1  wherein said step of providing a plurality of recesses at the edges of said foot portion comprises at least one of stamping, etching, milling, and drilling said plurality of recesses. 
   
   
     5. The method of  claim 1  wherein said steps of forming, creating and providing are performed by injection molding.