Inventor · disambiguated record
Steven H. C. Hsieh
Also filed as: HSIEH STEVEN · HSIEH STEVEN H C
8 granted patents·201 citations·filing 1993–2014
89Inventor score
Top patents by PatentIndex Score
8 records- 0191US6564986B1Method and assembly for testing solder joint fractures between integrated circuit package and printed circuit boardXILINX INC·Filed 2001·Granted May 20, 2003·86 cites·13 claims
- 0282US7429501B1Lid and method of employing a lid on an integrated circuitXILINX INC·Filed 2005·Granted Sep 30, 2008·10 cites·5 claims
- 0380US9559036B1Integrated circuit package with plated heat spreaderALTERA CORP·Filed 2014·Granted Jan 31, 2017·5 cites·11 claims
- 0479US5477138AApparatus and method for testing the calibration of a variety of electronic package lead inspection systemsVLSI TECHNOLOGY INC·Filed 1993·Granted Dec 19, 1995·51 cites·14 claims
- 0577US7012326B1Lid and method of employing a lid on an integrated circuitXILINX INC·Filed 2004·Granted Mar 14, 2006·22 cites·16 claims
- 0667US7257511B1Methods and circuits for measuring the thermal resistance of a packaged ICXILINX INC·Filed 2004·Granted Aug 14, 2007·12 cites·7 claims
- 0762US6847010B1Methods and circuits for measuring the thermal resistance of a packaged ICXILINX INC·Filed 2002·Granted Jan 25, 2005·9 cites·11 claims
- 0853US6895566B1Methods and apparatus for isolating critical paths on an IC device having a thermal energy generatorXILINX INC·Filed 2002·Granted May 17, 2005·6 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →