Inventor

HO MING-JAAN

TW65 patents

⚠️ This page may combine multiple inventors who share the name “HO MING-JAAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HO MING-JAAN

AVARY HOLDING SHENZHEN CO LTD

Ultrathin heat dissipation structure

Flexible circuit board and method for manufacturing same

Method of making flexible circuit board

Method for connecting stacked circuit boards

Bendable circuit board and method for manufacturing the same

Method for making a circuit board

Pressure sensor, pressure-sensitive circuit board, and manufacturing method for pressure-sensitive circuit board

Heat equalization plate

Pressure sensing circuit board and method for manufacturing the same

Heat equalization plate and method for manufacturing the same

Flexible printed circuit board, printed circuit board structure and method for manufacturing flexible printed circuit board

Wireless power consortium device and method for manufacturing the same

Printed circuit board and method for manufacturing the same

Transparent PCB and method for manufacturing the same

Covering film, and circuit board and manufacturing method

Method for manufacturing transmission circuit board

Method for making a heat dissipation structure

Transmission circuit board and method for manufacturing the same

Method for manufacturing an ultrathin heat dissipation structure

Method for manufacturing flexible printed circuit board

Heat dissipation device

Circuit board with embedded electronic component and method for manufacturing the same

Method of manufacturing physical structure for high frequency signal transmission

Printed circuit board and method for manufacturing the same

Flexible circuit board

Circuit board having conductive polymer

Cooling plate and method for manufacturing thereof

QING DING PREC ELECTRONICS HUAIAN CO LTD

Method for manufacturing interposer

Circuit board and manufacturing method thereof

Electromagnetic shielding film

Circuit board and manufacturing method thereof

Embedded circuit board and manufacturing method thereof

Embedded circuit board and manufacturing method thereof

Connecting structure

Method for connecting stacked circuits boards

Circuit board with heat dissipation structure and method for manufacturing same

Camera module and method for manufacturing the same

Adapter board and method for making adapter board

Method of manufacturing circuit board

FUKUI PREC COMPONENT SHENZHEN

Method for manufacturing printed circuit board with patterned electrically conductive layer therein visible

Heat dissipation device and method for manufacturing same

Flexible printed circuit board and method for making same

Flexible printed circuit board and method for manufacturing same

FUKUI PREC COMPONENT (SHENZHEN) CO LTD

Flexible circuit board and method for manufacturing same

Method for making conductive polymer, and composite film and circuit board having the conductive polymer

ZHEN DING TECH CO LTD

Low dielectric resin composition, film and circuit board using the same

Circuit board using low dielectric resin composition

HONGQISHENG PREC ELECTRONICS QINHUANGDAO CO LTD

Method of manufacturing multilayer circuit board

Multilayer circuit board and method of manufacturing the same

ZHEN DING TECHNOLOGY CO LTD

Resin coated copper foil, method for manufacturing same and multi-layer circuit board