Printed circuit board and method for manufacturing the same

Abstract

A method for manufacturing a printed circuit board (PCB) with high component density includes at least two reinforcing plates, at least two connecting plates, a first circuit board unit, and a second circuit board unit. The reinforcing plate includes a supporting portion, a first connecting portion, and a second connecting portion. The first connecting portion and the second connecting portion connect to ends of the supporting portion. The connecting plates are bendable circuit boards. Each connecting plate is attached to the supporting portion, the first connecting portion, and the second connecting portion of a reinforcing plate. The first circuit board unit is fixed and electrically connected to a connecting plate away from first connecting portion. The second circuit board unit is fixed and electrically connected to a connecting plate away from the second connecting portion.

What is claimed is: 
     
       1. A method for manufacturing a printed circuit board comprising:
 providing at least two reinforcing plates, each of the reinforcing plates comprising a supporting portion, a first connecting portion and a second connecting portion, the first connecting portion and the second connecting portion connected to two ends of the supporting portion to form a shape of a “⊏” reinforcing plate; and 
 attaching each of at least two connecting plates to the supporting portion, the first connecting portion and the second connecting portion of one of the two reinforcing plates; 
 fixing and electrically connecting a first circuit board unit to a side of each of the two connecting plates away from first connecting portion; and 
 fixing and electrically connecting a second circuit board unit to a side of each of the two connecting plates away from the second connecting portion. 
 
     
     
       2. The method of  claim 1 , wherein the first circuit board unit is electrically connected to the connection plates by solder paste. 
     
     
       3. The method of  claim 1 , wherein the first circuit board unit is electrically connected to the connection plates by anisotropic conductive adhesive. 
     
     
       4. The method of  claim 1  further comprising making the at least two connecting plates comprising:
 providing a copper clad unit comprising a base layer and a copper foil layer; 
 depositing a wiring layer on the copper foil layer by patterning lines on the copper foil layer to form a line pattern; 
 disposing a cover layer disposed on the wiring layer to cover the line pattern, wherein an opening is defined in the cover layer to expose a portion of two ends of the line pattern to form an exposed portion; and 
 surface treating on the exposed portion so that the exposed portion is electrically connectable to an external structure. 
 
     
     
       5. The method of  claim 4 , wherein the exposed portion is surface treated by electroless nickel immersion gold, oxidation prevention or electroless nickel electroless palladium immersion gold. 
     
     
       6. The method of  claim 1 , wherein each of the connecting plates is a bendable flexible circuit board. 
     
     
       7. The method of  claim 1 , wherein an angle between the first connecting portion and the supporting portion is between 85° and 95°. 
     
     
       8. The method of  claim 1 , wherein an angle between the second connecting portion and the supporting portion is between 85° and 95°. 
     
     
       9. The method of  claim 1 , wherein the reinforcing plates are made of conductive material.