Inventor · disambiguated record
Ming-Jaan Ho
Also filed as: HO MING-JAAN
64 granted patents·23 pending applications·62 citations·filing 2013–2024
97Inventor score
Files withAVARY HOLDING SHENZHEN CO LTD33QING DING PREC ELECTRONICS HUAIAN CO LTD21FUKUI PREC COMPONENT (SHENZHEN) CO LTD10FUKUI PREC COMPONENT SHENZHEN10ZHEN DING TECH CO LTD5
Top patents by PatentIndex Score
87 records- 0194US9485859B1Flexible circuit board and method for manufacturing sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2015·Granted Nov 1, 2016·17 cites·20 claims
- 0292US10117328B1Flexible circuit board and method for manufacturing sameAVARY HOLDING SHENZHEN CO LTD·Filed 2017·Granted Oct 30, 2018·11 cites·20 claims
- 0390US10448540B2Ultrathin heat dissipation structureAVARY HOLDING SHENZHEN CO LTD·Filed 2016·Granted Oct 15, 2019·8 cites·10 claims
- 0488US10894882B2Low dielectric resin composition, film and circuit board using the sameZHEN DING TECH CO LTD·Filed 2018·Granted Jan 19, 2021·2 cites·12 claims
- 0586US10863620B1Bendable circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Dec 8, 2020·2 cites·10 claims
- 0685US11765818B2Method for manufacturing transmission circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2022·Granted Sep 19, 2023·1 cites·14 claims
- 0782US12369275B2Heat equalization plateAVARY HOLDING SHENZHEN CO LTD·Filed 2023·Granted Jul 22, 2025·0 cites·5 claims
- 0880US11134564B1Transparent PCB and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Sep 28, 2021·1 cites·10 claims
- 0980US10575406B1Method of making flexible circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2018·Granted Feb 25, 2020·2 cites·6 claims
- 1078US12156348B2Embedded circuit board and manufacturing method thereofQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·7 claims
- 1178US10205487B1Wireless power consortium device and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2018·Granted Feb 12, 2019·1 cites·20 claims
- 1278US9066431B2Method for manufacturing printed circuit board with patterned electrically conductive layer therein visibleFUKUI PREC COMPONENT SHENZHEN·Filed 2013·Granted Jun 23, 2015·4 cites·8 claims
- 1376US11483938B2Method for connecting stacked circuit boardsAVARY HOLDING SHENZHEN CO LTD·Filed 2018·Granted Oct 25, 2022·2 cites·11 claims
- 1476US2024422920A1Circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2024·Application pending·0 cites
- 1575US10910300B1Method for manufacturing interposerQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2019·Granted Feb 2, 2021·2 cites·12 claims
- 1674US10104771B1Method for making a circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2017·Granted Oct 16, 2018·2 cites·7 claims
- 1772US11261328B2Circuit board using low dielectric resin compositionZHEN DING TECH CO LTD·Filed 2020·Granted Mar 1, 2022·0 cites·10 claims
- 1872US10321561B2Flexible printed circuit board, printed circuit board structure and method for manufacturing flexible printed circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2017·Granted Jun 11, 2019·1 cites·11 claims
- 1972US2022312655A1Method for manufacturing electromagnetic shielding filmQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2022·Application pending·0 cites
- 2071US11991838B2Embedded circuit board and manufacturing method thereofQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2022·Granted May 21, 2024·0 cites·10 claims
- 2171US11665833B2Circuit board and manufacturing method thereofQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2021·Granted May 30, 2023·0 cites·6 claims
- 2271US2022394859A1Method of manufacturing circuit boardQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2022·Application pending·0 cites
- 2370US11672100B2Heat equalization plate and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Jun 6, 2023·0 cites·13 claims
- 2470US11297748B2Electromagnetic shielding filmQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2018·Granted Apr 5, 2022·0 cites·4 claims
- 2569US11979977B2Circuit board with heat dissipation structure and method for manufacturing sameQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2019·Granted May 7, 2024·1 cites·14 claims
- 2669US11510319B2Connecting structureQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2021·Granted Nov 22, 2022·0 cites·10 claims
- 2769US9992858B2Printed circuit boardFUKUI PREC COMPONENT SHENZHEN·Filed 2017·Granted Jun 5, 2018·1 cites·4 claims
- 2869US9807868B1Method for making conductive polymer, and composite film and circuit board having the conductive polymerFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2016·Granted Oct 31, 2017·1 cites·7 claims
- 2968US12320718B2Pressure sensing circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·13 claims
- 3068US10822522B2Modified polyimide compound, resin composition and polyimide filmZHEN DING TECH CO LTD·Filed 2019·Granted Nov 3, 2020·0 cites·9 claims
- 3168US2025122400A1Disperant, composition, and pressure-sensitive filmAVARY HOLDING SHENZHEN CO LTD·Filed 2023·Application pending·0 cites
- 3267US11252818B2Printed circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Feb 15, 2022·0 cites·9 claims
- 3367US2021385944A1Transparent pcb and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2021·Application pending·0 cites
- 3466US11259405B2Transmission circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Feb 22, 2022·0 cites·14 claims
- 3566US9277640B2Flexible printed circuit board and method for manufacturing sameFUKUI PREC COMPONENT SHENZHEN·Filed 2014·Granted Mar 1, 2016·1 cites·8 claims
- 3665US10533811B2Heat dissipation deviceAVARY HOLDING SHENZHEN CO LTD·Filed 2018·Granted Jan 14, 2020·0 cites·15 claims
- 3765US9706640B2Method for manufacturing printed circuit boardFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2015·Granted Jul 11, 2017·1 cites·9 claims
- 3864US11665820B2Adapter board and method for making adapter boardQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2021·Granted May 30, 2023·0 cites·7 claims
- 3964US9615445B2Flexible circuit board and method for manufacturing sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2015·Granted Apr 4, 2017·1 cites·20 claims
- 4063US10874016B2Method of manufacturing physical structure for high frequency signal transmissionAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Granted Dec 22, 2020·0 cites·13 claims
- 4162US10660210B2Flexible circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Granted May 19, 2020·0 cites·9 claims
- 4261US12063752B2Methods of manufacturing circuit board and circuit board assemblyAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Aug 13, 2024·0 cites·11 claims
- 4361US11212922B2Circuit board and manufacturing method thereofQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2019·Granted Dec 28, 2021·0 cites·5 claims
- 4461US10745595B2Resin composition, adhesive layer, and circuit board utilizing sameQING DING PREC ELECTRONICS (HUAIAN) CO LTD·Filed 2018·Granted Aug 18, 2020·0 cites·11 claims
- 4561US10428238B2Resin composition, polyimide film and method for manufacturing polyimide filmZHEN DING TECH CO LTD·Filed 2017·Granted Oct 1, 2019·0 cites·5 claims
- 4660US10849229B2Printed circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Granted Nov 24, 2020·0 cites·11 claims
- 4760US10791625B2Method for manufacturing flexible printed circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Granted Sep 29, 2020·0 cites·9 claims
- 4860US10658265B2Heat dissipation structure, method for making the same, and electronic device having the sameFUKUI PREC COMPONENT SHENZHEN·Filed 2017·Granted May 19, 2020·0 cites·6 claims
- 4960US2025207986A1Pressure sensing flexible circuit board and method of fabricating the sameQINGDING PREC ELECTRONICS HUAI’AN CO LTD·Filed 2023·Application pending·0 cites
- 5059US12048084B2Covering film, and circuit board and manufacturing methodAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Jul 23, 2024·0 cites·12 claims
Showing the top 50 of 87 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →