Assignee
AVARY HOLDING SHENZHEN CO LTD
CN·94 granted patents·27 pending applications·64 citations·filing 2015–2024
Top patents by PatentIndex Score
121 records- 0196US11197368B1High-frequency circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Dec 7, 2021·4 cites·6 claims
- 0293US11968788B2Fixing belt of wearable device, method for manufacturing the same, and wearable deviceAVARY HOLDING SHENZHEN CO LTD·Filed 2021·Granted Apr 23, 2024·3 cites·15 claims
- 0392US10117328B1Flexible circuit board and method for manufacturing sameAVARY HOLDING SHENZHEN CO LTD·Filed 2017·Granted Oct 30, 2018·11 cites·20 claims
- 0490US10448540B2Ultrathin heat dissipation structureAVARY HOLDING SHENZHEN CO LTD·Filed 2016·Granted Oct 15, 2019·8 cites·10 claims
- 0590US10187984B1Circuit board and method for making the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2017·Granted Jan 22, 2019·8 cites·5 claims
- 0688US12153252B2Method for manufacturing photoelectric composite circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2023·Granted Nov 26, 2024·1 cites·11 claims
- 0788US12101871B2Circuit board using thermocouple to dissipate generated heat and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2022·Granted Sep 24, 2024·1 cites·9 claims
- 0888US10881008B1Multi-layered circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Dec 29, 2020·4 cites·10 claims
- 0986US10863620B1Bendable circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Dec 8, 2020·2 cites·10 claims
- 1085US11765818B2Method for manufacturing transmission circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2022·Granted Sep 19, 2023·1 cites·14 claims
- 1182US12369275B2Heat equalization plateAVARY HOLDING SHENZHEN CO LTD·Filed 2023·Granted Jul 22, 2025·0 cites·5 claims
- 1281US11754781B2Circuit board utilizing optical signals in addition to electrical signals and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2021·Granted Sep 12, 2023·1 cites·5 claims
- 1380US11134564B1Transparent PCB and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Sep 28, 2021·1 cites·10 claims
- 1480US10575406B1Method of making flexible circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2018·Granted Feb 25, 2020·2 cites·6 claims
- 1578US10462902B1Circuit board and manufacturing methodAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Granted Oct 29, 2019·2 cites·9 claims
- 1678US10205487B1Wireless power consortium device and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2018·Granted Feb 12, 2019·1 cites·20 claims
- 1777US12063750B2Circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2022·Granted Aug 13, 2024·0 cites·9 claims
- 1876US11483938B2Method for connecting stacked circuit boardsAVARY HOLDING SHENZHEN CO LTD·Filed 2018·Granted Oct 25, 2022·2 cites·11 claims
- 1976US10356909B1Embedded circuit board and method of making sameAVARY HOLDING SHENZHEN CO LTD·Filed 2018·Granted Jul 16, 2019·2 cites·12 claims
- 2076US2024422920A1Circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2024·Application pending·0 cites
- 2174US12238852B2Circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·7 claims
- 2274US12082352B2Flexible circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·10 claims
- 2374US10104771B1Method for making a circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2017·Granted Oct 16, 2018·2 cites·7 claims
- 2474US2023199954A1Circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2023·Application pending·0 cites
- 2572US11700685B2Method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2021·Granted Jul 11, 2023·0 cites·9 claims
- 2672US10321561B2Flexible printed circuit board, printed circuit board structure and method for manufacturing flexible printed circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2017·Granted Jun 11, 2019·1 cites·11 claims
- 2772US2024040687A1Circuit board assemblyAVARY HOLDING SHENZHEN CO LTD·Filed 2023·Application pending·0 cites
- 2871US12028967B2Method of manufacturing wiring substrateAVARY HOLDING SHENZHEN CO LTD·Filed 2023·Granted Jul 2, 2024·0 cites·9 claims
- 2971US11576257B2Circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2022·Granted Feb 7, 2023·0 cites·10 claims
- 3070US11699671B2Packaged circuit structure including circuit strcutre with antennaAVARY HOLDING SHENZHEN CO LTD·Filed 2022·Granted Jul 11, 2023·0 cites·13 claims
- 3170US11672100B2Heat equalization plate and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Jun 6, 2023·0 cites·13 claims
- 3270US9832888B1Circuit board and method for making the sameAVARY HOLDING (SHENZHEN) CO LTD·Filed 2016·Granted Nov 28, 2017·2 cites·7 claims
- 3369US11617263B2Circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2021·Granted Mar 28, 2023·0 cites·4 claims
- 3469US11570883B2Method for manufacturing a circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2021·Granted Jan 31, 2023·0 cites·10 claims
- 3569US11160166B2Printed circuit board with high-capacity copper circuitAVARY HOLDING SHENZHEN CO LTD·Filed 2018·Granted Oct 26, 2021·1 cites·11 claims
- 3669US10993327B2Circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Granted Apr 27, 2021·1 cites·18 claims
- 3768US12320718B2Pressure sensing circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·13 claims
- 3868US11523517B2Circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Dec 6, 2022·0 cites·8 claims
- 3968US2025122400A1Disperant, composition, and pressure-sensitive filmAVARY HOLDING SHENZHEN CO LTD·Filed 2023·Application pending·0 cites
- 4067US11445618B2Flexible circuit board and method for manufacturing sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Sep 13, 2022·0 cites·6 claims
- 4167US11252818B2Printed circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Feb 15, 2022·0 cites·9 claims
- 4267US11246212B2Printed circuit board deformable in both length and widthAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Granted Feb 8, 2022·1 cites·9 claims
- 4367US2021385944A1Transparent pcb and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2021·Application pending·0 cites
- 4466US11825595B2Manufacturing method of circuit board assemblyAVARY HOLDING SHENZHEN CO LTD·Filed 2021·Granted Nov 21, 2023·0 cites·8 claims
- 4566US11259405B2Transmission circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Feb 22, 2022·0 cites·14 claims
- 4665US11696391B2Wiring substrate and method of manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2021·Granted Jul 4, 2023·0 cites·15 claims
- 4765US10533811B2Heat dissipation deviceAVARY HOLDING SHENZHEN CO LTD·Filed 2018·Granted Jan 14, 2020·0 cites·15 claims
- 4865US10499496B2Length- and width-deformable printed circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2017·Granted Dec 3, 2019·1 cites·6 claims
- 4965US2026024929A1Multilayered flexible flat cable and manufacturing method thereofAVARY HOLDING SHENZHEN CO LTD·Filed 2024·Application pending·0 cites
- 5064US12529612B2Pressure sensor, pressure-sensitive circuit board, and manufacturing method for pressure-sensitive circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2021·Granted Jan 20, 2026·0 cites·20 claims
Showing the top 50 of 121 patent records by PatentIndex Score.
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