Transparent pcb and method for manufacturing the same

Abstract

A transparent PCB includes a transparent base film, a hardened layer, an electrode film, a first conductive paste, a second conductive paste, and an electronic component. The hardened layer is formed on a side of the transparent base film. The electrode film is formed on a side of the hardened layer. The electrode film includes a first transparent conductive oxide layer, a metal layer, and a second transparent conductive oxide layer. The first conductive paste is formed on the electrode film. The second conductive paste is formed on the electrode film and spaced from the first conductive paste. The electronic component is electrically connected to the electrode film through the first conductive paste and the second conductive paste. The present invention also needs to provide a method for manufacturing the transparent PCB.

What is claimed is: 
     
         1 . A transparent PCB comprising:
 a transparent base film;   a hardened layer formed on a side of the transparent base film;   an electrode film formed on a side of the hardened layer facing away from the transparent base film, wherein the electrode film comprises a first transparent conductive oxide layer, a metal layer, and a second transparent conductive oxide layer that are stacked and patterned, the first transparent conductive oxide layer is formed on the side of the transparent base film, the metal layer is sandwiched between the second transparent conductive oxide layer and a side of the first transparent conductive oxide layer  32  facing away from the transparent base film;   a first conductive paste formed on a side of the electrode film facing away from the transparent base film;   a second conductive paste formed on the side of the electrode film facing away from the transparent base film and spaced from the first conductive paste; and   an electronic component electrically connected to the electrode film through the first conductive paste and the second conductive paste.   
     
     
         2 . The transparent PCB of  claim 1 , wherein the transparent PCB further comprises a first connecting pad and a second connecting pad, the first connecting pad and the second connecting pad are spaced from each other, the first connecting pad is sandwiched between the first conductive paste and the side of the electrode film facing away from the transparent base film, the second connecting pad is sandwiched between the second conductive paste and the side of the electrode film facing away from the transparent base film. 
     
     
         3 . The transparent PCB of  claim 2 , wherein the first connecting pad is embedded in the first conductive paste, the second connecting pad is embedded in the second conductive paste. 
     
     
         4 . The transparent PCB of  claim 2 , wherein the transparent PCB further comprises a covering layer, the covering layer covers a surface of the first conductive paste connecting a surface of the first conductive paste facing away from the transparent base film and a surface of the first conductive paste facing the transparent base film, covers a surface of the second conductive paste connecting a surface of the second conductive paste facing away from the transparent base film and a surface of the second conductive paste facing the transparent base film, covers a surface of the first connecting pad connecting a surface of the first connecting pad facing away from the transparent base film and a surface of the first connecting pad facing the transparent base film, and covers a surface of the second connecting pad connecting a surface of the second connecting pad facing away from the transparent base film and a surface of the second connecting pad facing the transparent base film. 
     
     
         5 . The transparent PCB of  claim 2 , wherein a thickness of the first connecting pad and a thickness of the second connecting pad are in a range of 4 μm to 35 μm, respectively. 
     
     
         6 . The transparent PCB of  claim 1 , wherein the transparent PCB further comprises a protective layer formed a portion of a surface of the electrode film facing the transparent base film and exposed from the first conductive paste and the second conductive paste. 
     
     
         7 . The transparent PCB of  claim 1 , wherein a light transmittance of the transparent base film is in a range of 88% to 95%. 
     
     
         8 . The transparent PCB of  claim 1 , wherein a light transmittance of the oxide film is in a range of 82% to 95%. 
     
     
         9 . The transparent PCB of  claim 1 , wherein a sheet resistance of the oxide film is in a range of 10 Ω/m 2  to 200 Ω/m 2 . 
     
     
         10 . The transparent PCB of  claim 1 , wherein a thickness of the oxide film is in a range of 200 nm to 250 nm.