Inventor · disambiguated record
Fu-Yun Shen
Also filed as: SHEN FU-YUN
33 granted patents·19 pending applications·33 citations·filing 2013–2024
94Inventor score
Files withAVARY HOLDING SHENZHEN CO LTD26QING DING PREC ELECTRONICS HUAIAN CO LTD11FUKUI PREC COMPONENT SHENZHEN8FUKUI PREC COMPONENT (SHENZHEN) CO LTD5QINGDING PREC ELECTRONICS HUAI’AN CO LTD1
Top patents by PatentIndex Score
52 records- 0196US11197368B1High-frequency circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Dec 7, 2021·4 cites·6 claims
- 0294US9485859B1Flexible circuit board and method for manufacturing sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2015·Granted Nov 1, 2016·17 cites·20 claims
- 0385US11765818B2Method for manufacturing transmission circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2022·Granted Sep 19, 2023·1 cites·14 claims
- 0482US12369275B2Heat equalization plateAVARY HOLDING SHENZHEN CO LTD·Filed 2023·Granted Jul 22, 2025·0 cites·5 claims
- 0580US11134564B1Transparent PCB and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Sep 28, 2021·1 cites·10 claims
- 0680US10575406B1Method of making flexible circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2018·Granted Feb 25, 2020·2 cites·6 claims
- 0778US10205487B1Wireless power consortium device and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2018·Granted Feb 12, 2019·1 cites·20 claims
- 0876US2024422920A1Circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2024·Application pending·0 cites
- 0974US10104771B1Method for making a circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2017·Granted Oct 16, 2018·2 cites·7 claims
- 1072US11700685B2Method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2021·Granted Jul 11, 2023·0 cites·9 claims
- 1172US2022312655A1Method for manufacturing electromagnetic shielding filmQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2022·Application pending·0 cites
- 1271US11665833B2Circuit board and manufacturing method thereofQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2021·Granted May 30, 2023·0 cites·6 claims
- 1371US2022394859A1Method of manufacturing circuit boardQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2022·Application pending·0 cites
- 1470US11672100B2Heat equalization plate and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Jun 6, 2023·0 cites·13 claims
- 1570US11297748B2Electromagnetic shielding filmQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2018·Granted Apr 5, 2022·0 cites·4 claims
- 1669US11979977B2Circuit board with heat dissipation structure and method for manufacturing sameQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2019·Granted May 7, 2024·1 cites·14 claims
- 1768US12320718B2Pressure sensing circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·13 claims
- 1867US2021385944A1Transparent pcb and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2021·Application pending·0 cites
- 1966US11259405B2Transmission circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Feb 22, 2022·0 cites·14 claims
- 2066US9277640B2Flexible printed circuit board and method for manufacturing sameFUKUI PREC COMPONENT SHENZHEN·Filed 2014·Granted Mar 1, 2016·1 cites·8 claims
- 2165US10533811B2Heat dissipation deviceAVARY HOLDING SHENZHEN CO LTD·Filed 2018·Granted Jan 14, 2020·0 cites·15 claims
- 2265US9107311B2Method for manufacturing printed circuit boardFUKUI PREC COMPONENT SHENZHEN·Filed 2013·Granted Aug 11, 2015·2 cites·4 claims
- 2364US9615445B2Flexible circuit board and method for manufacturing sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2015·Granted Apr 4, 2017·1 cites·20 claims
- 2462US10660210B2Flexible circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Granted May 19, 2020·0 cites·9 claims
- 2562US2025369809A1Strain sensing structure and method of fabricating the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2024·Application pending·0 cites
- 2662US2025137857A1Sensing module and method of manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2023·Application pending·0 cites
- 2761US12063752B2Methods of manufacturing circuit board and circuit board assemblyAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Aug 13, 2024·0 cites·11 claims
- 2861US11212922B2Circuit board and manufacturing method thereofQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2019·Granted Dec 28, 2021·0 cites·5 claims
- 2961US10745595B2Resin composition, adhesive layer, and circuit board utilizing sameQING DING PREC ELECTRONICS (HUAIAN) CO LTD·Filed 2018·Granted Aug 18, 2020·0 cites·11 claims
- 3060US10658265B2Heat dissipation structure, method for making the same, and electronic device having the sameFUKUI PREC COMPONENT SHENZHEN·Filed 2017·Granted May 19, 2020·0 cites·6 claims
- 3160US2025207986A1Pressure sensing flexible circuit board and method of fabricating the sameQINGDING PREC ELECTRONICS HUAI’AN CO LTD·Filed 2023·Application pending·0 cites
- 3259US12048084B2Covering film, and circuit board and manufacturing methodAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Jul 23, 2024·0 cites·12 claims
- 3359US11457532B2Method of manufacturing circuit boardQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2018·Granted Sep 27, 2022·0 cites·7 claims
- 3458US10012454B2Heat dissipation device and method for manufacturing sameFUKUI PREC COMPONENT SHENZHEN·Filed 2015·Granted Jul 3, 2018·0 cites·10 claims
- 3556US9357631B2Flexible printed circuit board and method for making sameFUKUI PREC COMPONENT SHENZHEN·Filed 2014·Granted May 31, 2016·0 cites·12 claims
- 3655US11380603B2Method for making a heat dissipation structureAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Granted Jul 5, 2022·0 cites·10 claims
- 3755US2025137856A1Pressure-sensitive ink, flexible pressure sensing structure, and electronic deviceAVARY HOLDING SHENZHEN CO LTD·Filed 2023·Application pending·0 cites
- 3854US10365430B2Method for manufacturing high frequency signal transmission structure and high frequency signal transmission structure obtained therebyAVARY HOLDING SHENZHEN CO LTD·Filed 2017·Granted Jul 30, 2019·0 cites·26 claims
- 3950US2015053466A1Printed circuit board and method for manufacturing sameFUKUI PREC COMPONENT SHENZHEN·Filed 2014·Application pending·0 cites
- 4047US2022225510A1Circuit board and method for manufacturing the sameQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2022·Application pending·0 cites
- 4146US11778752B2Circuit board with embedded electronic component and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Oct 3, 2023·0 cites·10 claims
- 4246US2021392758A1Thin circuit board and method of manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Application pending·0 cites
- 4345US11950357B2Circuit board for transmitting high-frequency signal and method for manufacturing the sameQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2019·Granted Apr 2, 2024·0 cites·10 claims
- 4445US10278307B2Cooling plate and method for manufacturing thereofAVARY HOLDING SHENZHEN CO LTD·Filed 2017·Granted Apr 30, 2019·0 cites·10 claims
- 4545US2021399397A1High-frequency signal transmission structureand method for manufacturing the sameQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2020·Application pending·0 cites
- 4645US2015101785A1Heat dissipation device and a method for manufacturing sameFUKUI PREC COMPONENT SHENZHEN·Filed 2014·Application pending·0 cites
- 4745US2015189760A1Flexible printed circuit board and method for manufacturing sameFUKUI PREC COMPONENT SHENZHEN·Filed 2014·Application pending·0 cites
- 4845US2014054079A1Multilayer flexible printed circuit board and method for manufacturing sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 4944US2021059058A1Multilayer circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Application pending·0 cites
- 5036US2017188451A1Flexible circuit board and method for manufacturing sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2016·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →