Inventor · disambiguated record
Hsiao-Ting Hsu
Also filed as: HSU HSIAO-TING
22 granted patents·13 pending applications·5 citations·filing 2016–2024
89Inventor score
Files withAVARY HOLDING SHENZHEN CO LTD20QING DING PREC ELECTRONICS HUAIAN CO LTD11FUKUI PREC COMPONENT (SHENZHEN) CO LTD2FUKUI PREC COMPONENT SHENZHEN1QINGDING PREC ELECTRONICS HUAI’AN CO LTD1
Top patents by PatentIndex Score
35 records- 0182US12369275B2Heat equalization plateAVARY HOLDING SHENZHEN CO LTD·Filed 2023·Granted Jul 22, 2025·0 cites·5 claims
- 0280US11134564B1Transparent PCB and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Sep 28, 2021·1 cites·10 claims
- 0380US10575406B1Method of making flexible circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2018·Granted Feb 25, 2020·2 cites·6 claims
- 0472US2022312655A1Method for manufacturing electromagnetic shielding filmQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2022·Application pending·0 cites
- 0571US11665833B2Circuit board and manufacturing method thereofQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2021·Granted May 30, 2023·0 cites·6 claims
- 0671US2022394859A1Method of manufacturing circuit boardQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2022·Application pending·0 cites
- 0770US11672100B2Heat equalization plate and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Jun 6, 2023·0 cites·13 claims
- 0870US11297748B2Electromagnetic shielding filmQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2018·Granted Apr 5, 2022·0 cites·4 claims
- 0969US11979977B2Circuit board with heat dissipation structure and method for manufacturing sameQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2019·Granted May 7, 2024·1 cites·14 claims
- 1069US9807868B1Method for making conductive polymer, and composite film and circuit board having the conductive polymerFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2016·Granted Oct 31, 2017·1 cites·7 claims
- 1168US12320718B2Pressure sensing circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·13 claims
- 1268US2025122400A1Disperant, composition, and pressure-sensitive filmAVARY HOLDING SHENZHEN CO LTD·Filed 2023·Application pending·0 cites
- 1367US2021385944A1Transparent pcb and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2021·Application pending·0 cites
- 1463US10874016B2Method of manufacturing physical structure for high frequency signal transmissionAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Granted Dec 22, 2020·0 cites·13 claims
- 1562US10660210B2Flexible circuit boardAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Granted May 19, 2020·0 cites·9 claims
- 1662US2025369809A1Strain sensing structure and method of fabricating the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2024·Application pending·0 cites
- 1762US2025137857A1Sensing module and method of manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2023·Application pending·0 cites
- 1861US11212922B2Circuit board and manufacturing method thereofQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2019·Granted Dec 28, 2021·0 cites·5 claims
- 1961US10745595B2Resin composition, adhesive layer, and circuit board utilizing sameQING DING PREC ELECTRONICS (HUAIAN) CO LTD·Filed 2018·Granted Aug 18, 2020·0 cites·11 claims
- 2060US10658265B2Heat dissipation structure, method for making the same, and electronic device having the sameFUKUI PREC COMPONENT SHENZHEN·Filed 2017·Granted May 19, 2020·0 cites·6 claims
- 2160US2025207986A1Pressure sensing flexible circuit board and method of fabricating the sameQINGDING PREC ELECTRONICS HUAI’AN CO LTD·Filed 2023·Application pending·0 cites
- 2259US12048084B2Covering film, and circuit board and manufacturing methodAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Jul 23, 2024·0 cites·12 claims
- 2359US11457532B2Method of manufacturing circuit boardQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2018·Granted Sep 27, 2022·0 cites·7 claims
- 2456US10299367B2Circuit board having conductive polymerAVARY HOLDING SHENZHEN CO LTD·Filed 2017·Granted May 21, 2019·0 cites·10 claims
- 2555US11380603B2Method for making a heat dissipation structureAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Granted Jul 5, 2022·0 cites·10 claims
- 2655US2025137856A1Pressure-sensitive ink, flexible pressure sensing structure, and electronic deviceAVARY HOLDING SHENZHEN CO LTD·Filed 2023·Application pending·0 cites
- 2753US11417890B2Flexible battery assembly and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Granted Aug 16, 2022·0 cites·16 claims
- 2852US2017354030A1High frequency signal transmission structure and method for sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2016·Application pending·0 cites
- 2947US2022225510A1Circuit board and method for manufacturing the sameQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2022·Application pending·0 cites
- 3046US11778752B2Circuit board with embedded electronic component and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2020·Granted Oct 3, 2023·0 cites·10 claims
- 3146US2021392758A1Thin circuit board and method of manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Application pending·0 cites
- 3245US11950357B2Circuit board for transmitting high-frequency signal and method for manufacturing the sameQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2019·Granted Apr 2, 2024·0 cites·10 claims
- 3345US10278307B2Cooling plate and method for manufacturing thereofAVARY HOLDING SHENZHEN CO LTD·Filed 2017·Granted Apr 30, 2019·0 cites·10 claims
- 3445US2021399397A1High-frequency signal transmission structureand method for manufacturing the sameQING DING PREC ELECTRONICS HUAIAN CO LTD·Filed 2020·Application pending·0 cites
- 3544US2021059058A1Multilayer circuit board and method for manufacturing the sameAVARY HOLDING SHENZHEN CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →