Inventor · disambiguated record
Ali Sengül
Also filed as: SENGUL ALI · SENGÜL ALI
19 granted patents·3 pending applications·39 citations·filing 2019–2023
92Inventor score
Top patents by PatentIndex Score
22 records- 0198US10818643B1Rigid pickup head with conformable layerFACEBOOK TECH LLC·Filed 2020·Granted Oct 27, 2020·8 cites·16 claims
- 0295US11349053B1Flexible interconnect using conductive adhesiveFACEBOOK TECH LLC·Filed 2020·Granted May 31, 2022·5 cites·20 claims
- 0394US11296268B1Magnetic clamping interconnectsFACEBOOK TECH LLC·Filed 2020·Granted Apr 5, 2022·4 cites·9 claims
- 0493US11424214B1Hybrid interconnect for laser bonding using nanoporous metal tipsMETA PLATFORMS TECH LLC·Filed 2020·Granted Aug 23, 2022·3 cites·10 claims
- 0588US11417792B1Interconnect with nanotube fittingFACEBOOK TECH LLC·Filed 2020·Granted Aug 16, 2022·2 cites·12 claims
- 0688US11255529B1Bonding corners of light emitting diode chip to substrate using laserFACEBOOK TECH LLC·Filed 2019·Granted Feb 22, 2022·5 cites·13 claims
- 0787US11374148B2Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heatingFACEBOOK TECH LLC·Filed 2020·Granted Jun 28, 2022·2 cites·10 claims
- 0886US11101159B1Pickup head with photocurable polymers for assembling light emitting diodesFACEBOOK TECH LLC·Filed 2020·Granted Aug 24, 2021·2 cites·10 claims
- 0985US11239400B1Curved pillar interconnectsFACEBOOK TECH LLC·Filed 2020·Granted Feb 1, 2022·2 cites·19 claims
- 1081US11563142B2Curing pre-applied and plasma-etched underfill via a laserFACEBOOK TECH LLC·Filed 2020·Granted Jan 24, 2023·1 cites·20 claims
- 1179US11107948B1Fluidic pick-up head for assembling light emitting diodesFACEBOOK TECH LLC·Filed 2019·Granted Aug 31, 2021·2 cites·15 claims
- 1277US11735689B2Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heatingFACEBOOK TECH LLC·Filed 2022·Granted Aug 22, 2023·0 cites·20 claims
- 1377US2022393060A1Curing pre-applied and laser-ablated underfill via a laserFACEBOOK TECH LLC·Filed 2022·Application pending·0 cites
- 1476US11328942B1Liquid crystalline elastomer for pick and place of semiconductor devicesFACEBOOK TECH LLC·Filed 2019·Granted May 10, 2022·2 cites·20 claims
- 1574US11276672B1Bonding dummy electrodes of light emitting diode chip to substrateFACEBOOK TECH LLC·Filed 2019·Granted Mar 15, 2022·1 cites·10 claims
- 1669US11575069B2Employing deformable contacts and pre-applied underfill for bonding LED devices via lasersFACEBOOK TECH LLC·Filed 2020·Granted Feb 7, 2023·0 cites·11 claims
- 1768US10989735B2Atomic force microscopy tips for interconnectionFACEBOOK TECH LLC·Filed 2020·Granted Apr 27, 2021·0 cites·15 claims
- 1866US2023352437A1Hybrid interconnect for laser bonding using nanoporous metal tipsMETA PLATFORMS TECH LLC·Filed 2022·Application pending·0 cites
- 1954US11756810B1Detection of force applied by pick-up tool for transferring semiconductor devicesMETA PLATFORMS TECH LLC·Filed 2019·Granted Sep 12, 2023·0 cites·19 claims
- 2054US2024136339A1Micro-display panel for near-eye displayMETA PLATFORMS TECH LLC·Filed 2023·Application pending·0 cites
- 2149US11670531B2Bridge pick-up head for transferring semiconductor devicesMETA PLATFORMS TECH LLC·Filed 2019·Granted Jun 6, 2023·0 cites·16 claims
- 2247US11404600B2Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasersFACEBOOK TECH LLC·Filed 2020·Granted Aug 2, 2022·0 cites·13 claims
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