Hybrid interconnect for laser bonding using nanoporous metal tips

Abstract

Embodiments relate to using nanoporous metal tips to establish connections between a first body and a second body. The first body is positioned relative to the second body to align contacts protruding from a first surface of the first body with electrodes protruding from a second surface of the second body. The second surface faces the first surface. The contacts, the electrodes, or both comprise nanoporous metal tips. A relative movement is made between the first body and the second body after positioning the first body to approach the first body to the second body. The contacts and the electrodes are bonded by melting and solidifying the nanoporous metal tips after approaching the first body and the second body.

What is claimed is: 
     
         1 . An electronic device comprising:
 a first body comprising contacts protruding from a first surface of the first body;   a second body comprising electrodes protruding from a second surface of the second body facing the first surface; and   bonding metal of the contacts and electrodes formed by melting and solidifying nanoporous metal tips on at least one of the contacts and the electrodes.   
     
     
         2 . The electronic device of claim  7 , wherein the nanoporous metal tips are nanoporous gold tips. 
     
     
         3 . The electronic device of claim  7 , wherein each of the contacts and each of the electrodes comprise a solid metal base on the first body or the second body. 
     
     
         4 . The electronic device of claim  7 , wherein one of the first body and the second body comprises a light emitting diode (LED) with a size that is less than 100 micrometers (μm) and the other of the first body and the second body comprises a circuit to operate the LED.