Inventor · disambiguated record
Zheng Sung Chio
Also filed as: CHIO ZHENG SUNG
18 granted patents·4 pending applications·31 citations·filing 2017–2023
91Inventor score
Top patents by PatentIndex Score
22 records- 0195US11349053B1Flexible interconnect using conductive adhesiveFACEBOOK TECH LLC·Filed 2020·Granted May 31, 2022·5 cites·20 claims
- 0294US11296268B1Magnetic clamping interconnectsFACEBOOK TECH LLC·Filed 2020·Granted Apr 5, 2022·4 cites·9 claims
- 0393US11424214B1Hybrid interconnect for laser bonding using nanoporous metal tipsMETA PLATFORMS TECH LLC·Filed 2020·Granted Aug 23, 2022·3 cites·10 claims
- 0488US11417792B1Interconnect with nanotube fittingFACEBOOK TECH LLC·Filed 2020·Granted Aug 16, 2022·2 cites·12 claims
- 0588US11255529B1Bonding corners of light emitting diode chip to substrate using laserFACEBOOK TECH LLC·Filed 2019·Granted Feb 22, 2022·5 cites·13 claims
- 0688US10734442B2Optoelectronic device with light-emitting diodesAledia·Filed 2017·Granted Aug 4, 2020·3 cites·20 claims
- 0787US11579182B1Probe card for efficient screening of highly-scaled monolithic semiconductor devicesFACEBOOK TECH LLC·Filed 2020·Granted Feb 14, 2023·2 cites·8 claims
- 0887US11374148B2Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heatingFACEBOOK TECH LLC·Filed 2020·Granted Jun 28, 2022·2 cites·10 claims
- 0985US11239400B1Curved pillar interconnectsFACEBOOK TECH LLC·Filed 2020·Granted Feb 1, 2022·2 cites·19 claims
- 1081US11563142B2Curing pre-applied and plasma-etched underfill via a laserFACEBOOK TECH LLC·Filed 2020·Granted Jan 24, 2023·1 cites·20 claims
- 1181US2023253524A1Selectively bonding light-emitting devices via a pulsed laserMETA PLATFORMS TECH LLC·Filed 2023·Application pending·0 cites
- 1278US11677051B1Application of underfill via centrifugal forceMETA PLATFORMS TECH LLC·Filed 2020·Granted Jun 13, 2023·1 cites·10 claims
- 1377US11735689B2Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heatingFACEBOOK TECH LLC·Filed 2022·Granted Aug 22, 2023·0 cites·20 claims
- 1477US2022393060A1Curing pre-applied and laser-ablated underfill via a laserFACEBOOK TECH LLC·Filed 2022·Application pending·0 cites
- 1574US11276672B1Bonding dummy electrodes of light emitting diode chip to substrateFACEBOOK TECH LLC·Filed 2019·Granted Mar 15, 2022·1 cites·10 claims
- 1670US11557692B2Selectively bonding light-emitting devices via a pulsed laserFACEBOOK TECH LLC·Filed 2020·Granted Jan 17, 2023·0 cites·24 claims
- 1769US11575069B2Employing deformable contacts and pre-applied underfill for bonding LED devices via lasersFACEBOOK TECH LLC·Filed 2020·Granted Feb 7, 2023·0 cites·11 claims
- 1868US10989735B2Atomic force microscopy tips for interconnectionFACEBOOK TECH LLC·Filed 2020·Granted Apr 27, 2021·0 cites·15 claims
- 1966US2023352437A1Hybrid interconnect for laser bonding using nanoporous metal tipsMETA PLATFORMS TECH LLC·Filed 2022·Application pending·0 cites
- 2054US2024313152A1Optoelectronic device and manufacturing methodAledia·Filed 2022·Application pending·0 cites
- 2147US11404600B2Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasersFACEBOOK TECH LLC·Filed 2020·Granted Aug 2, 2022·0 cites·13 claims
- 2243US10916580B2Optoelectronic device with light-emitting diodesAledia·Filed 2017·Granted Feb 9, 2021·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →