Inventor · disambiguated record
Daniel Brodoceanu
Also filed as: BRODOCEANU DANIEL
40 granted patents·5 pending applications·77 citations·filing 2017–2023
96Inventor score
Top patents by PatentIndex Score
45 records- 0198US10818643B1Rigid pickup head with conformable layerFACEBOOK TECH LLC·Filed 2020·Granted Oct 27, 2020·8 cites·16 claims
- 0295US11349053B1Flexible interconnect using conductive adhesiveFACEBOOK TECH LLC·Filed 2020·Granted May 31, 2022·5 cites·20 claims
- 0394US11296268B1Magnetic clamping interconnectsFACEBOOK TECH LLC·Filed 2020·Granted Apr 5, 2022·4 cites·9 claims
- 0493US11424214B1Hybrid interconnect for laser bonding using nanoporous metal tipsMETA PLATFORMS TECH LLC·Filed 2020·Granted Aug 23, 2022·3 cites·10 claims
- 0593US10998286B1Laser-induced selective heating for microLED placement and bondingFACEBOOK TECH LLC·Filed 2018·Granted May 4, 2021·10 cites·11 claims
- 0692US10586725B1Method for polymer-assisted chip transferFACEBOOK TECH LLC·Filed 2018·Granted Mar 10, 2020·8 cites·20 claims
- 0791US10840418B1Fabricating parabolic-shaped LEDsFACEBOOK TECH LLC·Filed 2019·Granted Nov 17, 2020·6 cites·20 claims
- 0888US11417792B1Interconnect with nanotube fittingFACEBOOK TECH LLC·Filed 2020·Granted Aug 16, 2022·2 cites·12 claims
- 0988US11255529B1Bonding corners of light emitting diode chip to substrate using laserFACEBOOK TECH LLC·Filed 2019·Granted Feb 22, 2022·5 cites·13 claims
- 1087US11579182B1Probe card for efficient screening of highly-scaled monolithic semiconductor devicesFACEBOOK TECH LLC·Filed 2020·Granted Feb 14, 2023·2 cites·8 claims
- 1187US11374148B2Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heatingFACEBOOK TECH LLC·Filed 2020·Granted Jun 28, 2022·2 cites·10 claims
- 1286US11101159B1Pickup head with photocurable polymers for assembling light emitting diodesFACEBOOK TECH LLC·Filed 2020·Granted Aug 24, 2021·2 cites·10 claims
- 1385US11239400B1Curved pillar interconnectsFACEBOOK TECH LLC·Filed 2020·Granted Feb 1, 2022·2 cites·19 claims
- 1483US10832933B1Dry-etching of carrier substrate for microLED microassemblyFACEBOOK TECH LLC·Filed 2018·Granted Nov 10, 2020·3 cites·17 claims
- 1581US11563142B2Curing pre-applied and plasma-etched underfill via a laserFACEBOOK TECH LLC·Filed 2020·Granted Jan 24, 2023·1 cites·20 claims
- 1681US2023253524A1Selectively bonding light-emitting devices via a pulsed laserMETA PLATFORMS TECH LLC·Filed 2023·Application pending·0 cites
- 1779US11107948B1Fluidic pick-up head for assembling light emitting diodesFACEBOOK TECH LLC·Filed 2019·Granted Aug 31, 2021·2 cites·15 claims
- 1879US10269781B1Elastomeric layer fabrication for light emitting diodesFACEBOOK TECH LLC·Filed 2018·Granted Apr 23, 2019·2 cites·20 claims
- 1978US11677051B1Application of underfill via centrifugal forceMETA PLATFORMS TECH LLC·Filed 2020·Granted Jun 13, 2023·1 cites·10 claims
- 2078US10910514B1Molded etch masksFACEBOOK TECH LLC·Filed 2018·Granted Feb 2, 2021·2 cites·18 claims
- 2177US11735689B2Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heatingFACEBOOK TECH LLC·Filed 2022·Granted Aug 22, 2023·0 cites·20 claims
- 2277US11152533B1Etchant-accessible carrier substrate for display manufactureFACEBOOK TECH LLC·Filed 2019·Granted Oct 19, 2021·2 cites·23 claims
- 2377US2022393060A1Curing pre-applied and laser-ablated underfill via a laserFACEBOOK TECH LLC·Filed 2022·Application pending·0 cites
- 2476US11328942B1Liquid crystalline elastomer for pick and place of semiconductor devicesFACEBOOK TECH LLC·Filed 2019·Granted May 10, 2022·2 cites·20 claims
- 2574US11276672B1Bonding dummy electrodes of light emitting diode chip to substrateFACEBOOK TECH LLC·Filed 2019·Granted Mar 15, 2022·1 cites·10 claims
- 2672US11344971B1Microlens arrays for parallel micropatterningFACEBOOK TECH LLC·Filed 2019·Granted May 31, 2022·1 cites·20 claims
- 2770US11557692B2Selectively bonding light-emitting devices via a pulsed laserFACEBOOK TECH LLC·Filed 2020·Granted Jan 17, 2023·0 cites·24 claims
- 2869US11575069B2Employing deformable contacts and pre-applied underfill for bonding LED devices via lasersFACEBOOK TECH LLC·Filed 2020·Granted Feb 7, 2023·0 cites·11 claims
- 2968US10989735B2Atomic force microscopy tips for interconnectionFACEBOOK TECH LLC·Filed 2020·Granted Apr 27, 2021·0 cites·15 claims
- 3068US10964867B2Using underfill or flux to promote placing and parallel bonding of light emitting diodesFACEBOOK TECH LLC·Filed 2019·Granted Mar 30, 2021·1 cites·13 claims
- 3166US2023352437A1Hybrid interconnect for laser bonding using nanoporous metal tipsMETA PLATFORMS TECH LLC·Filed 2022·Application pending·0 cites
- 3265US2022266385A1Microlens arrays for parallel micropatterningFACEBOOK TECH LLC·Filed 2022·Application pending·0 cites
- 3361US10685946B2Elastomeric layer fabrication for light emitting diodesFACEBOOK TECH LLC·Filed 2019·Granted Jun 16, 2020·0 cites·20 claims
- 3456US2021210667A1Using underfill or flux to promote placing and parallel bonding of light emitting diodesFACEBOOK TECH LLC·Filed 2021·Application pending·0 cites
- 3555US10319705B2Elastomeric layer fabrication for light emitting diodesFACEBOOK TECH LLC·Filed 2017·Granted Jun 11, 2019·0 cites·20 claims
- 3654US11756810B1Detection of force applied by pick-up tool for transferring semiconductor devicesMETA PLATFORMS TECH LLC·Filed 2019·Granted Sep 12, 2023·0 cites·19 claims
- 3753US10998215B2Monitoring dry-etching of polymer layer for transferring semiconductor devicesFACEBOOK TECH LLC·Filed 2018·Granted May 4, 2021·0 cites·17 claims
- 3849US11670531B2Bridge pick-up head for transferring semiconductor devicesMETA PLATFORMS TECH LLC·Filed 2019·Granted Jun 6, 2023·0 cites·16 claims
- 3949US10568242B1Dynamic adjustment of placement parameters for light emitting diodesFACEBOOK TECH LLC·Filed 2018·Granted Feb 18, 2020·0 cites·20 claims
- 4048US11005014B2Optics formation using pick-up toolsFACEBOOK TECH LLC·Filed 2018·Granted May 11, 2021·0 cites·17 claims
- 4147US11404600B2Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasersFACEBOOK TECH LLC·Filed 2020·Granted Aug 2, 2022·0 cites·13 claims
- 4247US10811575B2Laser lift-off masksFACEBOOK TECH LLC·Filed 2018·Granted Oct 20, 2020·0 cites·20 claims
- 4346US11011687B1Micro light emitting diode with remnants of fabrication substrate for structural supportFACEBOOK TECH LLC·Filed 2018·Granted May 18, 2021·0 cites·18 claims
- 4446US10388516B1Method for polymer-assisted chip transferFACEBOOK TECH LLC·Filed 2018·Granted Aug 20, 2019·0 cites·17 claims
- 4543US10559486B1Method for polymer-assisted chip transferFACEBOOK TECH LLC·Filed 2018·Granted Feb 11, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →