Inventor
CHU WEI-CHEN
TW36 patents
Patents
36 patentsUS10269715B2Apr 23, 2019
Split rail structures located in adjacent metal layers
TAIWAN SEMICONDUCTOR MFG CO LTD29 citations94
US10020261B2Jul 10, 2018
Split rail structures located in adjacent metal layers
TAIWAN SEMICONDUCTOR MFG CO LTD31 citations94
US11729969B1Aug 15, 2023
Semiconductor device and method of operating the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations86
US11088020B2Aug 10, 2021
Structure and formation method of interconnection structure of semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10991618B2Apr 27, 2021
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US11764106B2Sep 19, 2023
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11183422B2Nov 23, 2021
Semiconductor structure and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10957580B2Mar 23, 2021
Metal routing with flexible space formed using self-aligned spacer patterning
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10734275B2Aug 4, 2020
Metal routing with flexible space formed using self-aligned spacer patterning
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10714421B2Jul 14, 2020
Structure and formation method of semiconductor device with self-aligned conductive features
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10534273B2Jan 14, 2020
Multi-metal fill with self-aligned patterning and dielectric with voids
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10529617B2Jan 7, 2020
Metal routing with flexible space formed using self-aligned spacer patterning
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10340181B2Jul 2, 2019
Interconnect structure including air gap
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10026647B2Jul 17, 2018
Multi-metal fill with self-align patterning
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US12300600B2May 13, 2025
Semiconductor device with self-aligned conductive features
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12230534B2Feb 18, 2025
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12094816B2Sep 17, 2024
Semiconductor structure having deep metal line and method for forming the semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12058852B2Aug 6, 2024
Semiconductor device and method of operating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12002709B2Jun 4, 2024
Interconnect structure and manufacturing method for the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11860550B2Jan 2, 2024
Multi-metal fill with self-aligned patterning and dielectric with voids
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11422475B2Aug 23, 2022
Multi-metal fill with self-aligned patterning and dielectric with voids
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11404367B2Aug 2, 2022
Method for forming semiconductor device with self-aligned conductive features
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11107725B2Aug 31, 2021
Interconnect structure and manufacturing method for the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10818596B2Oct 27, 2020
Method for forming semiconductor device structure with graphene layer
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US10276396B2Apr 30, 2019
Method for forming semiconductor device with damascene structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12183671B2Dec 31, 2024
Hybrid metal line structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11682618B2Jun 20, 2023
Hybrid metal line structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12575397B2Mar 10, 2026
Metal lines of hybrid heights
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10804143B2Oct 13, 2020
Semiconductor structure and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10784151B2Sep 22, 2020
Interconnect structure and manufacturing method for the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10784155B2Sep 22, 2020
Multi-metal fill with self-align patterning
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10522469B2Dec 31, 2019
Split rail structures located in adjacent metal layers
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10483159B2Nov 19, 2019
Multi-metal fill with self-align patterning
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10074607B2Sep 11, 2018
Semiconductor device structure with graphene layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10535560B2Jan 14, 2020
Interconnection structure of semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42
US10163690B2Dec 25, 2018
2-D interconnections for integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42