Inventor

SULLIVAN TIMOTHY D

US133 patents

⚠️ This page may combine multiple inventors who share the name “SULLIVAN TIMOTHY D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SULLIVAN TIMOTHY D

IBM

Cooling microfan arrangements and process

Structure and method for monitoring stress-induced degradation of conductive interconnects

Process for producing metal interconnections and product produced thereby

Electronic fuse structure and method of manufacturing

Laternal field emmission devices and methods of fabrication

Cooling microfan arrangements and process

Lateral field emission devices

Semiconductor chip structures with embedded thermal conductors and a thermal sink disposed over opposing substrate surfaces

Liner with improved electromigration redundancy for damascene interconnects

Monolithically integrated solid-state sige thermoelectric energy converter for high speed and low power circuits

Monolithically integrated solid-state SiGe thermoelectric energy converter for high speed and low power circuits

Semiconductor chip structures with embedded thermal conductors

Upper redundant layer for damascene metallization

Solder interconnect pads with current spreading layers

Dual-damascene metallization interconnection

Enhancement of performance of a conductive wire in a multilayered substrate

Micro-electro-mechanical RF switch

Semiconductor chip structures with embedded thermal conductors and a thermal sink disposed over opposing substrate surfaces

Multiple device test layout

Method and apparatus for accelerated determination of electromigration characteristics of semiconductor wiring

Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip

IC chip package having IC chip with overhang and/or BGA blocking underfill material flow and related methods

Structures and methods for improving solder bump connections in semiconductor devices

Design structure for alpha particle sensor in SOI technology and structure thereof

Test structure for locating electromigration voids in dual damascene interconnects

Electromigration monitor

Overcoming chip warping to enhance wetting of solder bumps and flip chip attaches in a flip chip package

Heat dissipation from IC interconnects

Trench type buried on-chip precision programmable resistor

Programmable electrical fuse in keep out zone

Thermal via for 3D integrated circuits structures

Optoelectronic memory devices

Dual damascene multi-level metallization

Micro-electro-mechanical RF switch

Process for X-ray mask warpage reduction

DAUBENSPECK TIMOTHY H

Metal pad structure for thickness enhancement of polymer used in electrical interconnection of semiconductor die to semiconductor chip package substrate with solder bump

Combination via and pad structure for improved solder bump electromigration characteristics

Structures and methods to improve lead-free C4 interconnect reliability

Underfill flow guide structures

Chip package solder interconnect formed by surface tension

Metal wiring structures for uniform current density in C4 balls

GLOBALFOUNDRIES INC

Chip joining by induction heating

IC structure with recessed solder bump area and methods of forming same

Chip joining by induction heating

ARVIN CHARLES L

Structures for improving current carrying capability of interconnects and methods of fabricating the same

Solder interconnect with non-wettable sidewall pillars and methods of manufacture

GUGEL DONALD E

Basketball shooting trainer device

CANNON ETHAN H

Array of alpha particle sensors

LI BAOZHEN

Electromigration resistant via-to-line interconnect

US NAVY

Piezoelectric polymer rectangular flexural plate hydrophone