P

Inventor

CHANG FU-CHEN

TW40 patents
⚠️ This page may combine multiple inventors who share the name “CHANG FU-CHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

39 patents
US12041861B2Jul 16, 2024

RRAM bottom electrode

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11706930B2Jul 18, 2023

Semiconductor device and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11367658B2Jun 21, 2022

Semiconductor die singulation and structures formed thereby

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11296099B2Apr 5, 2022

FeRAM decoupling capacitor

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11227872B2Jan 18, 2022

FeRAM MFM structure with selective electrode etch

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11189788B2Nov 30, 2021

RRAM bottom electrode

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11183503B2Nov 23, 2021

Memory cell having top and bottom electrodes defining recesses

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US10720360B2Jul 21, 2020

Semiconductor die singulation and structures formed thereby

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10510605B2Dec 17, 2019

Semiconductor die singulation and structures formed thereby

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11611038B2Mar 21, 2023

Method for forming RRAM with a barrier layer

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10950784B2Mar 16, 2021

RRAM with a barrier layer

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10535554B2Jan 14, 2020

Semiconductor die having edge with multiple gradients and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12593623B2Mar 31, 2026

RRAM with a barrier layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12593458B2Mar 31, 2026

Semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12457751B2Oct 28, 2025

Interfacial layer with high texture uniformity for ferroelectric layer enhancement

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12432929B2Sep 30, 2025

Ferroelectric memory device with blocking layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12369327B2Jul 22, 2025

MFM device with an enhanced bottom electrode

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12356875B2Jul 8, 2025

RRAM bottom electrode

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12356630B2Jul 8, 2025

Semiconductor device and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12167611B2Dec 10, 2024

FeRAM MFM structure with selective electrode etch

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12114509B2Oct 8, 2024

FeRAM decoupling capacitor

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12087618B2Sep 10, 2024

Method for forming semiconductor die having edge with multiple gradients

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12082421B2Sep 3, 2024

Semiconductor device and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11856788B2Dec 26, 2023

Semiconductor device and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11849588B2Dec 19, 2023

Semiconductor device and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11800720B2Oct 24, 2023

Memory cell having a top electrode interconnect arranged laterally from a recess

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11785777B2Oct 10, 2023

FeRAM MFM structure with selective electrode etch

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11723213B2Aug 8, 2023

Method and structures pertaining to improved ferroelectric random-access memory (FeRAM)

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11557609B2Jan 17, 2023

Integrated circuit structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11296116B2Apr 5, 2022

Semiconductor device and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11004728B2May 11, 2021

Semiconductor die having edge with multiple gradients and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12238934B2Feb 25, 2025

Method of fabricating semiconductor device comprising ferroelectric layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12040019B2Jul 16, 2024

Methods for enlarging the memory window and improving data retention in resistive memory device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11682456B2Jun 20, 2023

Methods for enlarging the memory window and improving data retention in restistive memory device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12171104B2Dec 17, 2024

Method and structures pertaining to improved ferroelectric random-access memory (FeRAM)

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12057154B2Aug 6, 2024

Method for efficiently waking up ferroelectric memory

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10056275B2Aug 21, 2018

Immersion de-taping

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations45
US9613845B2Apr 4, 2017

Immersion de-taping

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations45
US10861761B2Dec 8, 2020

Semiconductor packaged wafer and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations38

(unassigned)

1 patent