Inventor

HOEGERL JUERGEN

DE79 patents

⚠️ This page may combine multiple inventors who share the name “HOEGERL JUERGEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HOEGERL JUERGEN

INFINEON TECHNOLOGIES AG

Semiconductor chip package comprising semiconductor chip and leadframe disposed between two substrates

Insulated die

Method for producing a semiconductor wafer, semiconductor chip, and intermediate semiconductor product

Electronic component with a semiconductor chip and method for producing the electronic component

Cooling system for devices having power semiconductors and method for cooling the device

Package with interconnections having different melting temperatures

Smart card module arrangement

Module unit for memory modules and method for its production

Semiconductor module having interconnected semiconductor chips disposed one above the other

Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the same

Package with vertically spaced partially encapsulated contact structures

Heat sink for surface-mounted semiconductor devices and mounting method

Semiconductor module with a number of semiconductor chips and a conductive connection between the semiconductor chips by flexible tapes

Sensor devices having a sensor chip and busbar

Chip carrier configured for delamination-free encapsulation and stable sintering

Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement

Apparatus for determining a state of a rechargeable battery or of a battery, a rechargeable battery or a battery, and a method for determining a state of a rechargeable battery or of a battery

Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a semiconductor arrangement

Electronic component with sheet-like redistribution structure

Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module

Semiconductor package comprising two semiconductor modules and laterally extending connectors

Semiconductor assembly with a semiconductor module

Semiconductor package having overlapping electrically conductive regions and method for producing the same

Chip card with integrated active components

Semiconductor package having symmetrically arranged power terminals and method for producing the same

Smart card module, smart card and method for producing a smart card module

Configuration of a plurality of circuit modules

Housing for semiconductor chips

Sensor devices with sensor chip and busbar

Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module

Electronic module and method of manufacturing the same

Semiconductor device having solderable and bondable electrical contact pads

Smart card module and method for producing a smart card module

Semiconductor device for an ultra wideband standard for ultra-high-frequency communication, and method for producing the same

Semiconductor module with external power sensor

Power semiconductor module and method for fabricating the same

Semiconductor module comprising transistor chips, diode chips and driver chips arranged in a common plane

Semiconductor module with external power sensor

Fluid-cooled package having shielding layer

Package cooled with cooling fluid and comprising shielding layer

Package with partially encapsulated cooling channel for cooling an encapsulated chip

Double-sided coolable semiconductor package

Double sided semiconductor package

Method for populating a substrate with electronic components

Package with roughened encapsulated surface for promoting adhesion

Method and device for packaging and transporting electronic components

Laminate package of chip on carrier and in cavity

INFINEON TECHNOLOGIES AUSTRIA AG

Electronic module comprising a plurality of encapsulation layers and a method for producing it

PUESCHNER FRANK

Chip card module

HOEGERL JUERGEN

Data carrier for contactless data transmission and a method for producing such a data carrier