Inventor
PARK NO SUN
KR22 patents
⚠️ This page may combine multiple inventors who share the name “PARK NO SUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
14 patentsUS7977783B1Jul 12, 2011
Wafer level chip size package having redistribution layers
AMKOR TECHNOLOGY INC132 citations97
US9831282B2Nov 28, 2017
Electronic device package and fabricating method thereof
AMKOR TECHNOLOGY INC9 citations92
US9129873B2Sep 8, 2015
Package of finger print sensor and fabricating method thereof
AMKOR TECHNOLOGY INC10 citations92
US10692918B2Jun 23, 2020
Electronic device package and fabricating method thereof
AMKOR TECHNOLOGY INC3 citations84
US10304890B2May 28, 2019
Electronic device package and fabricating method thereof
AMKOR TECHNOLOGY INC5 citations84
US9466580B2Oct 11, 2016
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC9 citations84
US9431447B2Aug 30, 2016
Package of finger print sensor and fabricating method thereof
AMKOR TECHNOLOGY INC8 citations84
US9293403B2Mar 22, 2016
Semiconductor package with improved redistribution layer design and fabricating method thereof
AMKOR TECHNOLOGY INC8 citations80
US9929113B2Mar 27, 2018
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC3 citations73
US9406639B2Aug 2, 2016
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC2 citations63
US9184148B2Nov 10, 2015
Semiconductor package and method therefor
AMKOR TECHNOLOGY INC3 citations62
US10535620B2Jan 14, 2020
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC0 citations52
US10115705B2Oct 30, 2018
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC0 citations52
US9543235B2Jan 10, 2017
Semiconductor package and method therefor
AMKOR TECHNOLOGY INC0 citations52
AMKOR TECH SINGAPORE HOLDING PTE LTD
5 patentsUS12230661B2Feb 18, 2025
Electronic device package and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11961867B2Apr 16, 2024
Electronic device package and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11842970B2Dec 12, 2023
Semiconductor package and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11362128B2Jun 14, 2022
Electronic device package and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11121102B2Sep 14, 2021
Semiconductor package and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62