Inventor

OH SE YONG

KR25 patents

⚠️ This page may combine multiple inventors who share the name “OH SE YONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OH SE YONG

SAMSUNG ELECTRONICS CO LTD

Wafer level stack structure for system-in-package and method thereof

Solder bump structure and method for forming a solder bump

Lead-on-chip semiconductor device package having an adhesive layer formed from liquid adhesive and method for manufacturing the same

Semiconductor module

Stacked chip package having upper chip provided with trenches and method of manufacturing the same

Semiconductor package

Stacked chip package having upper chip provided with trenches and method of manufacturing the same

Semiconductor package and package stack made thereof

Semiconductor package

Method of fabricating ultra thin flip-chip package

Ultra-thin semiconductor package device and method for manufacturing the same

Wafer level stack structure for system-in-package and method thereof

Method of forming metal lines and bumps for semiconductor devices

Ultra-thin semiconductor package device and method for manufacturing the same

Method for manufacturing a chip scale package having slits formed on a substrate

Wafer level stack structure for system-in-package and method thereof

Memory card having a control chip

Fabrication method of wafer level chip scale packages

Lead on chip semiconductor package

Water-soluble polymeric adhesion promoter and production method

Water-soluble polymeric adhesion promoter and production method

JUSUNG ENG CO LTD

Substrate inspection device and substrate inspection method

Substrate inspection device and substrate inspection method

SAMSUNG ELELCTRONICS CO LTD

Semiconductor package

LEE KANG-WOOK

Wafer level stack structure for system-in-package and method thereof