Inventor
RUDECK PAUL J
US36 patents
⚠️ This page may combine multiple inventors who share the name “RUDECK PAUL J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
34 patentsUS7212435B2May 1, 2007
Minimizing adjacent wordline disturb in a memory device
MICRON TECHNOLOGY INC68 citations98
US6272047B1Aug 7, 2001
Flash memory cell
MICRON TECHNOLOGY INC72 citations97
US6849501B2Feb 1, 2005
Methods for fabricating an improved floating gate memory cell
MICRON TECHNOLOGY INC60 citations96
US6461915B1Oct 8, 2002
Method and structure for an improved floating gate memory cell
MICRON TECHNOLOGY INC34 citations96
US6449189B2Sep 10, 2002
Flash memory cell for high efficiency programming
MICRON TECHNOLOGY INC41 citations96
US6445619B1Sep 3, 2002
Flash memory cell for high efficiency programming
MICRON TECHNOLOGY INC38 citations96
US6384447B2May 7, 2002
Flash memory cell for high efficiency programming
MICRON TECHNOLOGY INC55 citations96
US7272039B2Sep 18, 2007
Minimizing adjacent wordline disturb in a memory device
MICRON TECHNOLOGY INC27 citations92
US7257024B2Aug 14, 2007
Minimizing adjacent wordline disturb in a memory device
MICRON TECHNOLOGY INC14 citations92
US6713350B2Mar 30, 2004
Method to remove an oxide seam along gate stack edge, when nitride space formation begins with an oxide liner surrounding gate stack
MICRON TECHNOLOGY INC18 citations92
US6297092B1Oct 2, 2001
Method and structure for an oxide layer overlaying an oxidation-resistant layer
MICRON TECHNOLOGY INC23 citations92
US7294567B2Nov 13, 2007
Semiconductor contact device and method
MICRON TECHNOLOGY INC10 citations84
US7148547B2Dec 12, 2006
Semiconductor contact device
MICRON TECHNOLOGY INC12 citations84
US6587376B2Jul 1, 2003
Flash memory cell for high efficiency programming
MICRON TECHNOLOGY INC9 citations82
US7932557B2Apr 26, 2011
Semiconductor contact device
MICRON TECHNOLOGY INC6 citations74
US7420240B2Sep 2, 2008
Method to remove an oxide seam along gate stack edge, when nitride space formation begins with an oxide liner surrounding gate stack
MICRON TECHNOLOGY INC8 citations74
US7115458B2Oct 3, 2006
Gate coupling in floating-gate memory cells
MICRON TECHNOLOGY INC10 citations74
US7091549B2Aug 15, 2006
Programmable memory devices supported by semiconductor substrates
MICRON TECHNOLOGY INC5 citations74
US7015098B2Mar 21, 2006
Methods and structure for an improved floating gate memory cell
MICRON TECHNOLOGY INC7 citations74
US6803624B2Oct 12, 2004
Programmable memory devices supported by semiconductive substrates
MICRON TECHNOLOGY INC9 citations74
US6777291B2Aug 17, 2004
Methods of forming programmable memory devices comprising tungsten
MICRON TECHNOLOGY INC6 citations74
US6611019B2Aug 26, 2003
Method and structure for an improved floating gate memory cell
MICRON TECHNOLOGY INC6 citations74
US6577537B2Jun 10, 2003
Flash memory cell for high efficiency programming
MICRON TECHNOLOGY INC5 citations74
US6445620B2Sep 3, 2002
Flash memory cell for high efficiency programming
MICRON TECHNOLOGY INC5 citations74
US6434045B2Aug 13, 2002
Flash memory cell for high efficiency programming
MICRON TECHNOLOGY INC7 citations74
US6756268B2Jun 29, 2004
Modified source/drain re-oxidation method and system
MICRON TECHNOLOGY INC8 citations72
US6873005B2Mar 29, 2005
Programmable memory devices supported by semiconductor substrates
MICRON TECHNOLOGY INC3 citations63
US6566195B2May 20, 2003
Method and structure for an improved floating gate memory cell
MICRON TECHNOLOGY INC2 citations63
US7015111B2Mar 21, 2006
Use of selective oxidation to form asymmetrical oxide features during the manufacture of a semiconductor device
MICRON TECHNOLOGY INC3 citations62
US6653683B2Nov 25, 2003
Method and structure for an oxide layer overlying an oxidation-resistant layer
MICRON TECHNOLOGY INC4 citations62
US6608346B2Aug 19, 2003
Method and structure for an improved floating gate memory cell
MICRON TECHNOLOGY INC0 citations52
US7429514B2Sep 30, 2008
Use of selective oxidation to form asymmetrical oxide features during the manufacture of a semiconductor device
MICRON TECHNOLOGY INC0 citations51
US7271435B2Sep 18, 2007
Modified source/drain re-oxidation method and system
MICRON TECHNOLOGY INC0 citations50
US7037860B2May 2, 2006
Modified source/drain re-oxidation method and system
MICRON TECHNOLOGY INC0 citations50