Inventor
MIYAKI YOSHINORI
JP35 patents
⚠️ This page may combine multiple inventors who share the name “MIYAKI YOSHINORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
13 patentsUS6291273B1Sep 18, 2001
Plastic molded type semiconductor device and fabrication process thereof
HITACHI LTD208 citations99
US5637913AJun 10, 1997
Leadframe semiconductor integrated circuit device using the same and method of and process for fabricating the two
HITACHI LTD96 citations96
US5378656AJan 3, 1995
Leadframe, semiconductor integrated circuit device using the same, and method of and process for fabricating the same
HITACHI LTD103 citations96
US6340837B1Jan 22, 2002
Semiconductor device and method of fabricating the same
HITACHI LTD19 citations91
US7541667B2Jun 2, 2009
Semiconductor device and method of manufacturing the same
HITACHI LTD6 citations74
US6943456B2Sep 13, 2005
Plastic molded type semiconductor device and fabrication process thereof
HITACHI LTD6 citations74
US6661081B2Dec 9, 2003
Semiconductor device and its manufacturing method
HITACHI LTD7 citations74
US6553657B2Apr 29, 2003
Semiconductor device
HITACHI LTD5 citations74
US6541702B2Apr 1, 2003
Semiconductor device
HITACHI LTD9 citations74
US6444905B1Sep 3, 2002
Semiconductor device
HITACHI LTD8 citations74
US7038306B2May 2, 2006
Semiconductor integrated circuit device and method of manufacturing the same
HITACHI LTD5 citations73
US6441400B1Aug 27, 2002
Semiconductor device and method of fabricating the same
HITACHI LTD10 citations72
US6476479B2Nov 5, 2002
Semiconductor device and method of fabricating the same
HITACHI LTD1 citations50
RENESAS TECH CORP
12 patentsUS6891253B2May 10, 2005
Semiconductor integrated circuit device and method of manufacturing the same
RENESAS TECH CORP18 citations92
US7528473B2May 5, 2009
Electronic circuit, a semiconductor device and a mounting substrate
RENESAS TECH CORP12 citations83
US7323788B2Jan 29, 2008
Semiconductor device and manufacturing method of them
RENESAS TECH CORP10 citations81
US7335529B2Feb 26, 2008
Manufacturing method of a semiconductor device utilizing a flexible adhesive tape
RENESAS TECH CORP8 citations74
US6777262B2Aug 17, 2004
Method of packaging a semiconductor device having gull-wing leads with thinner end portions
RENESAS TECH CORP4 citations74
US7397114B2Jul 8, 2008
Semiconductor integrated circuit device and method of manufacturing the same
RENESAS TECH CORP6 citations73
US7211903B2May 1, 2007
Semiconductor device and manufacturing method of them
RENESAS TECH CORP7 citations71
US6692989B2Feb 17, 2004
Plastic molded type semiconductor device and fabrication process thereof
RENESAS TECH CORP2 citations63
US7678706B2Mar 16, 2010
Method of manufacturing a semiconductor device
RENESAS TECH CORP0 citations52
US7528014B2May 5, 2009
Semiconductor device and method of manufacturing the same
RENESAS TECH CORP0 citations52
US6962836B2Nov 8, 2005
Method of manufacturing a semiconductor device having leads stabilized during die mounting
RENESAS TECH CORP0 citations52
US7176056B2Feb 13, 2007
Semiconductor integrated circuit device and method of manufacturing the same
RENESAS TECH CORP0 citations51
RENESAS ELECTRONICS CORP
4 patentsUS10032745B2Jul 24, 2018
Method of manufacturing semiconductor device
RENESAS ELECTRONICS CORP2 citations73
US11081438B2Aug 3, 2021
Method of manufacturing semiconductor device
RENESAS ELECTRONICS CORP0 citations52
US10192851B2Jan 29, 2019
Method of manufacturing semiconductor device
RENESAS ELECTRONICS CORP0 citations52
US8710637B2Apr 29, 2014
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP0 citations48
HITACHI ULSI SYS CO LTD
3 patentsUS6960823B2Nov 1, 2005
Semiconductor device and method of manufacturing the same
HITACHI ULSI SYS CO LTD18 citations93
US6989334B2Jan 24, 2006
Manufacturing method of a semiconductor device
HITACHI ULSI SYS CO LTD6 citations74
US7247576B2Jul 24, 2007
Method of manufacturing a semiconductor device
HITACHI ULSI SYS CO LTD2 citations63