Leadframe semiconductor integrated circuit device using the same, and method of and process for fabricating the two

Abstract

In order to improve the package body cracking resistance of an LSI package at the reflow soldering and to provide both a leadframe suitable for fabricating the LSI package according to the flexible manufacturing system and an LSI using the leadframe, the adhered area between a semiconductor chip 2 and a resin is enlarged by making the external size of a die pad 3 smaller than that of the semiconductor chip to be mounted thereon. Moreover, a variety of semiconductor chips 2 having different external sizes can be mounted on the die pad 3 by cutting the leading ends of leads 5 to a suitable length in accordance with the external sizes of the semiconductor chips 2.

1. A semiconductor integrated circuit device comprising:
 a semiconductor chip having a main surface including semiconductor elements and a plurality of bonding pads;   a leadframe having:
 a chip mounting portion for mounting said semiconductor chip; 
 suspension leads unitarily formed with said chip mounting portion, a width of said chip mounting portion being wider than a width of each of said suspension leads, 
 a plurality of inner lead portions arranged to surround said semiconductor chip and being electrically connected with said bonding pads by bonding wires, and 
 a plurality of outer lead portions individually connected with said inner lead portions; and 
   a resin member sealing said semiconductor chip, said inner lead portions, said chip mounting portion, said suspension leads and said bonding wires;   wherein said chip mounting portion is smaller than said semiconductor chip and is positioned under a substantially central portion of said semiconductor chip, said semiconductor chip is fixed to said chip mounting portion by adhesive, said semiconductor chip is fixed to a part of each of said suspension leads by adhesive which is located under a peripheral portion of said semiconductor chip, and an adhesive region of said chip mounting portion and said semiconductor chip and an adhesive region of each of said suspension leads and said semiconductor chip are separated from each other and wherein said suspension leads and said chip mounting portion of said leadframe are continuously formed in an area of said semiconductor chip.   
     
     
       2. A semiconductor integrated circuit device according to  claim 1 , wherein each of said suspension leads includes a first portion and a second portion which is wider than said first portion, wherein said second portion is separated from said chip mounting portion and is positioned under said peripheral portion of said semiconductor chip, and wherein said semiconductor chip is fixed at said second portion of each of said suspension leads. 
     
     
       3. A semiconductor integrated circuit device according to  claim 1 , wherein said semiconductor chip is of a tetragonal shape. 
     
     
       4. A semiconductor integrated circuit device according to  claim 1 , wherein said semiconductor chip includes a rear surface opposing said main surface and is fixed to said chip mounting portion and said suspension leads at one portion of said rear surface, and wherein the other portion of said rear surface which is exposed from said chip mounting portion and said suspension leads is directly contacted to said resin member. 
     
     
       5. A semiconductor integrated circuit device according to  claim 2 , wherein said semiconductor chip is a rectangular shape and said suspension leads include four suspension leads, and wherein four corners of said rectangular-shaped semiconductor chip are supported by said four suspension leads. 
     
     
       6. A semiconductor integrated circuit device according to  claim 5 , wherein said resin member has a rectangular shape, and wherein said outer lead portions are extended outwardly from four sides of said rectangular-shaped resin member. 
     
     
       7. A semiconductor integrated circuit device according to  claim 6 , further comprising:
 a plurality of grooves for positioning the semiconductor chip, said grooves each formed on said four suspension leads.   
     
     
       8. A semiconductor integrated circuit device according to  claim 6 , further comprising:
 a plurality of projections for positioning the semiconductor chip, said projections each formed on said four suspension leads.   
     
     
       9. A semiconductor integrated circuit device according to  claim 7 , wherein said grooves are arranged on said four suspension leads so as to accord to four corners of said rectangular-shaped semiconductor chip. 
     
     
       10. A semiconductor integrated circuit device according to  claim 8 , wherein said projections are arranged on said four suspension leads so as to accord to four corners of said rectangular-shaped semiconductor chip. 
     
     
       11. A semiconductor integrated circuit device comprising:
 a semiconductor chip having a main surface including semiconductor elements and a plurality of bonding pads;   a leadframe having:
 a cracking suppression means for mounting said semiconductor chip thereon and for suppressing, during a reflow soldering processing, device cracking, wherein said cracking suppression means is a chip mounting portion which is smaller than said semiconductor chip and which is positioned under a substantially central portion of said semiconductor chip, 
 suspension leads unitarily formed with said chip mounting portion, a width of said chip mounting portion being wider than a width of each of said suspension leads, 
 a plurality of inner lead portions arranged to surround said semiconductor chip and being electrically connected with said bonding pads by bonding wires, and 
 a plurality of outer lead portions individually connected with said inner lead portions; and 
   a resin member sealing said semiconductor chip, said inner lead portions, said chip mounting portion, said suspension leads and said bonding wires;   wherein said semiconductor chip is fixed to said chip mounting portion by adhesive, said semiconductor chip is fixed to a part of each of said suspension leads by adhesive which is located under a peripheral portion of said semiconductor chip, and an adhesive region of said chip mounting portion and said semiconductor chip and an adhesive region of each of said suspension leads and said semiconductor chip are separated from each other and wherein said suspension leads and said chip mounting portion of said leadframe are continuously formed in an area of said semiconductor chip.   
     
     
       12. A semiconductor integrated circuit device according to  claim 11 , wherein said semiconductor chip includes a rear surface opposing said main surface and is fixed to said chip mounting portion and said suspension leads at one portion of said rear surface, and wherein the other portion of said rear surface which is exposed from said chip mounting portion and said suspension leads is directly contacted to said resin member. 
     
     
       13. A semiconductor integrated circuit device comprising:
 a semiconductor chip having a main surface including semiconductor elements and a plurality of bonding pads;   a leadframe having:
 a chip mounting portion for mounting said semiconductor chip, 
 suspension leads unitarily formed with said chip mounting portion, a width of said chip mounting portion being wider than a width of each of said suspension leads, 
 a plurality of inner lead portions arranged to surround said semiconductor chip and being electrically connected with said bonding pads by bonding wires, and 
 a plurality of outer lead portions individually connected with said inner lead portions; and 
   a resin member sealing said semiconductor chip, said inner lead portions, said chip mounting portion, said suspension leads and said bonding wires;   wherein said chip mounting portion is smaller than said semiconductor chip and is positioned under a substantially central portion of said semiconductor chip, said semiconductor chip is fixed to said chip mounting portion by adhesive, said semiconductor chip is fixed to a part of each of said suspension leads by adhesive which is located under a peripheral portion of said semiconductor chip, and an adhesive region of said chip mounting portion and said semiconductor chip and an adhesive region of each of said suspension leads and said semiconductor chip are separated from each other.   
     
     
       14. A semiconductor integrated circuit device comprising:
 a semiconductor chip having a main surface including semiconductor elements and a plurality of bonding pads;   a leadframe having:
 a cracking suppression means for mounting said semiconductor chip thereon and for suppressing, during a reflow soldering processing, device cracking, wherein said cracking suppression means is a chip mounting portion which is smaller than said semiconductor chip and which is positioned under a substantially central portion of said semiconductor chip, 
 suspension leads unitarily formed with said chip mounting portion, a width of said chip mounting portion being wider than a width of each of said suspension leads, 
 a plurality of inner lead portions arranged to surround said semiconductor chip and being electrically connected with said bonding pads by bonding wires, and 
 a plurality of outer lead portions individually connected with said inner lead portions; and 
   a resin member sealing said semiconductor chip, said inner lead portions, said chip mounting portion, said suspension leads and said bonding wires;   wherein said semiconductor chip is fixed to said chip mounting portion by adhesive, said semiconductor chip is fixed to a part of each of said suspension leads by adhesive which is located under a peripheral portion of said semiconductor chip, and an adhesive region of said chip mounting portion and said semiconductor chip and an adhesive region of each of said suspension leads and said semiconductor chip are separated from each other.   
     
     
       15. A semiconductor device comprising:
 (a) a semiconductor chip having a plurality of semiconductor elements and bonding pads formed on a main surface thereof;   (b) a lead frame having:   a chip mounting portion having one surface for mounting said semiconductor chip;   suspension leads continuously formed with said chip mounting portion; and   a plurality of leads each having an inner lead portion and an outer lead portion continuously formed with said inner lead portion and being arranged at a periphery of said chip mounting portion, said inner lead portions of said plurality of leads being electrically connected with said bonding pads of said semiconductor chip; and   (c) a resin member sealing said semiconductor chip, said chip mounting portion and said inner lead portions of said plurality of leads,   wherein a size of said chip mounting portion is smaller than that of said semiconductor chip, and   wherein said one surface of said chip mounting portion is a surface on which burrs are not formed, during formation of said chip mounting portion,   wherein said chip mounting portion is positioned under a substantially central portion of said semiconductor chip,   wherein said semiconductor chip is fixed to said chip mounting portion by an adhesive,   wherein said semiconductor chip is fixed to a part of each of suspension leads by an adhesive, and   wherein said suspension leads and said chip mounting portion of said lead frame are continuously formed in an area of said semiconductor chip.   
     
     
       16. A semiconductor device according to claim 15, wherein said burrs are formed when said lead frame is made by pressing. 
     
     
       17. A semiconductor device according to claim 15, wherein said chip mounting portion has a substantially circular form in a plane view. 
     
     
       18. A semiconductor device according to claim 16, wherein said chip mounting portion has a substantially cross form in a plane view. 
     
     
       19. A semiconductor device according to claim 15, wherein said inner lead portions of said plurality of leads are electrically connected with said bonding pads of said semiconductor chip by a plurality of bonding wires. 
     
     
       20. A semiconductor device according to claim 19, wherein parts of said inner lead portions of said plurality of leads, to which said plurality of bonding wires are connected, are plated. 
     
     
       21. A semiconductor device comprising:
 (a) a semiconductor chip having a plurality of semiconductor elements and bonding pads formed on a main surface thereof;   (b) a lead frame having:   a chip mounting portion for mounting said semiconductor chip;   suspension leads continuously formed with said chip mounting portion; and   a plurality of leads each having an inner lead portion and an outer lead portion continuously formed with said inner lead portion and being arranged at a periphery of said chip mounting portion,   (c) a plurality of bonding wires electrically connecting said inner lead portions of said plurality of leads with said bonding pads of said semiconductor chip respectively, each of said inner lead portions of said plurality of leads having one surface to which a corresponding bonding wire among said plurality of bonding wires is connected; and   (d) a resin member sealing said semiconductor chip, said plurality of bonding wires, said chip mounting portion and said inner lead portions of said plurality of leads,   wherein said one surface of said inner lead portion of each of said plurality of leads is a surface on which burrs are not formed, said burrs being resultant from formation of said plurality of leads,   wherein said chip mounting portion is positioned under a substantially central portion of said semiconductor chip,   wherein said semiconductor chip is fixed to said chip mounting portion by an adhesive,   wherein said semiconductor chip is fixed to a part of each of suspension leads by an adhesive, and   wherein said suspension leads and said chip mounting portion of said lead frame are continuously formed in an area of said semiconductor chip.   
     
     
       22. A semiconductor device according to claim 21, wherein a size of said chip mounting portion is smaller than that of said semiconductor chip. 
     
     
       23. A semiconductor device according to claim 21, wherein said burrs are formed when said lead frame is made by pressing. 
     
     
       24. A semiconductor device according to claim 22, wherein said chip mounting portion has a substantially circular form in a plane view. 
     
     
       25. A semiconductor device according to claim 22, wherein said chip mounting portion has a substantially cross form in a plane view. 
     
     
       26. A semiconductor device comprising:
 (a) a semiconductor chip having a plurality of semiconductor elements and bonding pads formed on a main surface thereof;   (b) a lead frame having:   a chip mounting portion having a first surface for mounting said semiconductor chip;   suspension leads continuously formed with said chip mounting portion; and   a plurality of leads each having an inner lead portion and an outer lead portion continuously formed with said inner lead portion and being arranged at a periphery of said chip mounting portion;   (c) a plurality of bonding wires electrically connecting said inner lead portions of said plurality of leads with said bonding pads of said semiconductor chip respectively, each of said inner lead portions of said plurality of leads having a second surface to which a corresponding bonding wire among said plurality of bonding wires is connected; and   (d) a resin member sealing said semiconductor chip, said plurality of bonding wires, said chip mounting portion and said inner lead portions of said plurality of leads,   wherein a size of said chip mounting portion is smaller than that of said semiconductor chip,   wherein said first surface of said chip mounting portion is a surface on which burrs are not formed, and   wherein said second surface of said inner lead portion of each of said plurality of leads is a surface on which said burrs are formed, said burrs resultant from formation of said chip mounting portion and said plurality of leads,   wherein said chip mounting portion is positioned under a substantially central portion of said semiconductor chip,   wherein said semiconductor chip is fixed to said chip mounting portion by an adhesive,   wherein said semiconductor chip is fixed to a part of each of suspension leads by an adhesive, and   wherein said suspension leads and said chip mounting portion of said lead frame are continuously formed in an area of said semiconductor chip.