Inventor · disambiguated record
Yoshinori Miyaki
Also filed as: MIYAKI YOSHINORI
35 granted patents·5 pending applications·612 citations·filing 1993–2019
97Inventor score
Files withHITACHI LTD13RENESAS TECH CORP12RENESAS ELECTRONICS CORP4HITACHI ULSI SYS CO LTD3MIYAKI YOSHINORI2
Top patents by PatentIndex Score
40 records- 0196US6291273B1Plastic molded type semiconductor device and fabrication process thereofHITACHI LTD·Filed 1996·Granted Sep 18, 2001·208 cites·18 claims
- 0296US5637913ALeadframe semiconductor integrated circuit device using the same and method of and process for fabricating the twoHITACHI LTD·Filed 1994·Granted Jun 10, 1997·96 cites·14 claims
- 0396US5378656ALeadframe, semiconductor integrated circuit device using the same, and method of and process for fabricating the sameHITACHI LTD·Filed 1993·Granted Jan 3, 1995·103 cites·23 claims
- 0485US8525306B2Semiconductor device and method of manufacturing the sameTASHIRO YUKINORI·Filed 2011·Granted Sep 3, 2013·15 cites·5 claims
- 0581US7323788B2Semiconductor device and manufacturing method of themRENESAS TECH CORP·Filed 2007·Granted Jan 29, 2008·10 cites·13 claims
- 0680US7397114B2Semiconductor integrated circuit device and method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Jul 8, 2008·6 cites·3 claims
- 0779US6891253B2Semiconductor integrated circuit device and method of manufacturing the sameRENESAS TECH CORP·Filed 2001·Granted May 10, 2005·18 cites·16 claims
- 0877US7541667B2Semiconductor device and method of manufacturing the sameHITACHI LTD·Filed 2005·Granted Jun 2, 2009·6 cites·7 claims
- 0976US6960823B2Semiconductor device and method of manufacturing the sameHITACHI ULSI SYS CO LTD·Filed 2002·Granted Nov 1, 2005·18 cites·3 claims
- 1069US10032745B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Jul 24, 2018·2 cites·8 claims
- 1166US6541702B2Semiconductor deviceHITACHI LTD·Filed 2002·Granted Apr 1, 2003·9 cites·6 claims
- 1265US7247576B2Method of manufacturing a semiconductor deviceHITACHI ULSI SYS CO LTD·Filed 2005·Granted Jul 24, 2007·2 cites·4 claims
- 1365US6558980B2Plastic molded type semiconductor device and fabrication process thereofFiled 2001·Granted May 6, 2003·11 cites·8 claims
- 1464US7528473B2Electronic circuit, a semiconductor device and a mounting substrateRENESAS TECH CORP·Filed 2004·Granted May 5, 2009·12 cites·13 claims
- 1563US6441400B1Semiconductor device and method of fabricating the sameHITACHI LTD·Filed 2002·Granted Aug 27, 2002·10 cites·2 claims
- 1660USRE43443ELeadframe semiconductor integrated circuit device using the same, and method of and process for fabricating the twoKAJIHARA YUJIRO·Filed 2001·Granted Jun 5, 2012·8 cites·26 claims
- 1759US7038306B2Semiconductor integrated circuit device and method of manufacturing the sameHITACHI LTD·Filed 2004·Granted May 2, 2006·5 cites·4 claims
- 1858US7335529B2Manufacturing method of a semiconductor device utilizing a flexible adhesive tapeRENESAS TECH CORP·Filed 2003·Granted Feb 26, 2008·8 cites·17 claims
- 1958US6989334B2Manufacturing method of a semiconductor deviceHITACHI ULSI SYS CO LTD·Filed 2003·Granted Jan 24, 2006·6 cites·8 claims
- 2058US6661081B2Semiconductor device and its manufacturing methodHITACHI LTD·Filed 2001·Granted Dec 9, 2003·7 cites·1 claims
- 2157US6943456B2Plastic molded type semiconductor device and fabrication process thereofHITACHI LTD·Filed 2004·Granted Sep 13, 2005·6 cites·7 claims
- 2257US6553657B2Semiconductor deviceHITACHI LTD·Filed 2002·Granted Apr 29, 2003·5 cites·4 claims
- 2357US6340837B1Semiconductor device and method of fabricating the sameHITACHI LTD·Filed 1999·Granted Jan 22, 2002·19 cites·15 claims
- 2456US7211903B2Semiconductor device and manufacturing method of themRENESAS TECH CORP·Filed 2004·Granted May 1, 2007·7 cites·12 claims
- 2554US6777262B2Method of packaging a semiconductor device having gull-wing leads with thinner end portionsRENESAS TECH CORP·Filed 2003·Granted Aug 17, 2004·4 cites·9 claims
- 2653US2009014855A1Semiconductor integrated circuit device and method of manufacturing the sameMIYAKI YOSHINORI·Filed 2008·Application pending·0 cites
- 2752US10192851B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Jan 29, 2019·0 cites·4 claims
- 2852US7678706B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted Mar 16, 2010·0 cites·7 claims
- 2948US7528014B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2005·Granted May 5, 2009·0 cites·9 claims
- 3047US8710637B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Apr 29, 2014·0 cites·5 claims
- 3147US6692989B2Plastic molded type semiconductor device and fabrication process thereofRENESAS TECH CORP·Filed 2003·Granted Feb 17, 2004·2 cites·8 claims
- 3245US11081438B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2019·Granted Aug 3, 2021·0 cites·10 claims
- 3345US6444905B1Semiconductor deviceHITACHI LTD·Filed 1999·Granted Sep 3, 2002·8 cites·7 claims
- 3445US2008087996A1Semiconductor device and manufacturing method of the sameMIYAKI YOSHINORI·Filed 2007·Application pending·0 cites
- 3543US6476479B2Semiconductor device and method of fabricating the sameHITACHI LTD·Filed 2002·Granted Nov 5, 2002·1 cites·5 claims
- 3641US7176056B2Semiconductor integrated circuit device and method of manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Feb 13, 2007·0 cites·9 claims
- 3741US6962836B2Method of manufacturing a semiconductor device having leads stabilized during die mountingRENESAS TECH CORP·Filed 2003·Granted Nov 8, 2005·0 cites·5 claims
- 3838US2001018264A1Semiconductor integrated circuit device and method of manufacturing the sameFiled 2001·Application pending·0 cites
- 3933US2001008779A1Semiconductor device and manufacturing methodFiled 2001·Application pending·0 cites
- 4033US2001006251A1Semiconductor device and manufacturing methodFiled 2000·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yoshinori Miyaki files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →