Inventor · disambiguated record
Sueo Kawai
Also filed as: KAWAI SUEO
40 granted patents·1,313 citations·filing 1980–2004
98Inventor score
Top patents by PatentIndex Score
40 records- 0198US5068712ASemiconductor deviceHITACHI LTD·Filed 1989·Granted Nov 26, 1991·165 cites·36 claims
- 0296US5637913ALeadframe semiconductor integrated circuit device using the same and method of and process for fabricating the twoHITACHI LTD·Filed 1994·Granted Jun 10, 1997·96 cites·14 claims
- 0396US5378656ALeadframe, semiconductor integrated circuit device using the same, and method of and process for fabricating the sameHITACHI LTD·Filed 1993·Granted Jan 3, 1995·103 cites·23 claims
- 0486US5530286ASemiconductor deviceHITACHI LTD·Filed 1994·Granted Jun 25, 1996·53 cites·6 claims
- 0585US5811877ASemiconductor device structureHITACHI LTD·Filed 1997·Granted Sep 22, 1998·84 cites·26 claims
- 0685US5041901ALead frame and semiconductor device using the sameHITACHI LTD·Filed 1990·Granted Aug 20, 1991·82 cites·20 claims
- 0785US4942452ALead frame and semiconductor deviceHITACHI LTD·Filed 1988·Granted Jul 17, 1990·72 cites·23 claims
- 0884US5358904ASemiconductor deviceHITACHI LTD·Filed 1992·Granted Oct 25, 1994·47 cites·15 claims
- 0984US5159434ASemiconductor device having a particular chip pad structureHITACHI LTD·Filed 1991·Granted Oct 27, 1992·68 cites·27 claims
- 1080US6326681B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Dec 4, 2001·14 cites·14 claims
- 1180US5793099ASemiconductor deviceHITACHI LTD·Filed 1996·Granted Aug 11, 1998·30 cites·12 claims
- 1279US6081023ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Jun 27, 2000·28 cites·13 claims
- 1378US5612569ASemiconductor deviceHITACHI LTD·Filed 1995·Granted Mar 18, 1997·35 cites·9 claims
- 1477US5229643ASemiconductor apparatus and semiconductor packageHITACHI LTD·Filed 1991·Granted Jul 20, 1993·54 cites·26 claims
- 1576US5047837ASemiconductor device with heat transfer capHITACHI LTD·Filed 1989·Granted Sep 10, 1991·46 cites·4 claims
- 1674US6303982B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Oct 16, 2001·10 cites·28 claims
- 1772US4645258AUnderframe construction for railway vehicleHITACHI LTD·Filed 1985·Granted Feb 24, 1987·29 cites·10 claims
- 1869US6130114ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Oct 10, 2000·17 cites·22 claims
- 1969US6018191ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jan 25, 2000·18 cites·23 claims
- 2069US5293068ASemiconductor deviceHITACHI LTD·Filed 1992·Granted Mar 8, 1994·35 cites·12 claims
- 2168US4987474ASemiconductor device and method of manufacturing the sameHITACHI LTD·Filed 1990·Granted Jan 22, 1991·41 cites·60 claims
- 2267US6531760B1Semiconductor deviceFiled 2000·Granted Mar 11, 2003·6 cites·8 claims
- 2367US5914530ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jun 22, 1999·15 cites·12 claims
- 2463US6100580ASemiconductor device having all outer leads extending from one side of a resin memberHITACHI LTD·Filed 1998·Granted Aug 8, 2000·17 cites·19 claims
- 2563US6069029ASemiconductor device chip on lead and lead on chip manufacturingHITACHI LTD·Filed 1998·Granted May 30, 2000·13 cites·36 claims
- 2661US6072231ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jun 6, 2000·12 cites·40 claims
- 2760USRE43443ELeadframe semiconductor integrated circuit device using the same, and method of and process for fabricating the twoKAJIHARA YUJIRO·Filed 2001·Granted Jun 5, 2012·8 cites·26 claims
- 2858USRE37690ELead frame and semiconductor deviceHITACHI LTD·Filed 1995·Granted May 7, 2002·25 cites·48 claims
- 2957US5101263ASemiconductor device and method for manufacturing the sameHITACHI LTD·Filed 1990·Granted Mar 31, 1992·27 cites·8 claims
- 3055US5194935APlastic encapsulated semiconductor device and structure for mounting the same devices having particular radiating fin structureHITACHI LTD·Filed 1991·Granted Mar 16, 1993·23 cites·29 claims
- 3153US6720208B2Semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Apr 13, 2004·2 cites·13 claims
- 3251US5981315ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Nov 9, 1999·7 cites·37 claims
- 3351US5821606ASemiconductor deviceHITACHI LTD·Filed 1997·Granted Oct 13, 1998·9 cites·45 claims
- 3450US5863817ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jan 26, 1999·7 cites·23 claims
- 3544US6919622B2Semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Jul 19, 2005·0 cites·6 claims
- 3641US6204552B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Mar 20, 2001·0 cites·15 claims
- 3737US6124629ASemiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chipHITACHI LTD·Filed 1998·Granted Sep 26, 2000·3 cites·9 claims
- 3837US5400668ASuperconducting magnet magnetically levitated transportation apparatusHITACHI LTD·Filed 1992·Granted Mar 28, 1995·11 cites·29 claims
- 3932US6100115ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Aug 8, 2000·1 cites·9 claims
- 4023US4331897ACommutator apparatus for rotary electric machineHITACHI LTD·Filed 1980·Granted May 25, 1982·0 cites·8 claims
Join the waitlist — get patent alerts
Get an alert when Sueo Kawai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →