Inventor

CHO TAE-JE

KR64 patents

⚠️ This page may combine multiple inventors who share the name “CHO TAE-JE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHO TAE-JE

SAMSUNG ELECTRONICS CO LTD

Lead-on-chip semiconductor device package having an adhesive layer formed from liquid adhesive and method for manufacturing the same

Semiconductor package

Semiconductor device package

Thin stacked package and manufacturing method thereof

Thin stacked package

Multi-chip package

Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip

Semiconductor package

Semiconductor package with ground projections

Wafer processing method and method of manufacturing semiconductor device by using the same

Semiconductor package

Semiconductor devices with solder-based connection terminals and method of forming the same

Semiconductor package having stacked semiconductor chips

Semiconductor package and method of manufacturing the semiconductor package

Method of manufacturing semiconductor package

Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device

Semiconductor package and method of fabricating the same

Semiconductor package having ink-jet type dam and method of manufacturing the same

High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same

Semiconductor packages having through electrodes and methods of fabricating the same

Semiconductor packages having through electrodes and methods of fabricating the same

Printed circuit board having a bond wire shield structure for a signal transmission line

Fan-out semiconductor package

Method of fabricating an interposer

Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip

Initiator and method for debonding wafer supporting system

Semiconductor package and method of manufacturing the same

Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package

Semiconductor package and manufacturing method thereof

Pre-package and methods of manufacturing semiconductor package and electronic device using the same

Non-conductive film and non-conductive paste including zinc particles, semiconductor package including the same, and method of manufacturing the semiconductor package

Semiconductor package

Lead frame having a lead with a non-uniform width

Interposer, semiconductor package, and method of fabricating interposer

System and method for predicting the temperature of a device

IM YUN-HYEOK

Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package

Semiconductor packages

LEE HO-JIN

Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device

KIM TAE-HYEONG

Semiconductor devices and package substrates having pillars and semiconductor packages and package stack structures having the same

SAMSUNG ELELCTRONICS CO LTD

Semiconductor package

LEE HO JIN

Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device

CHOI YUN-SEOK

Semiconductor package including a semiconductor chip with a through silicon via

YIM CHOONG-BIN

Semiconductor package having ink-jet type dam and method of manufacturing the same

KANG UN-BYOUNG

Chip-stacked semiconductor package and method of manufacturing the same

KWAK BYOUNG SOO

Semiconductor device including multiple semiconductor chips

SEO BYOUNG-RIM

Image sensor module having image sensor package

SAMSUNG ELECTRO MECH

Substrate having embedded interconnect structure

LEE SEOK HYUN

Semiconductor chip package and method of manufacturing the same

KO YEONG KWON

Alignment mark for semiconductor device

CHANG GUN-HO

Pre-package and methods of manufacturing semiconductor package and electronic device using the same