Inventor
SEO SUN-KYOUNG
KR20 patents
⚠️ This page may combine multiple inventors who share the name “SEO SUN-KYOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
14 patentsUS10083939B2Sep 25, 2018
Semiconductor package
SAMSUNG ELECTRONICS CO LTD12 citations92
US9666551B1May 30, 2017
Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip
SAMSUNG ELECTRONICS CO LTD17 citations92
US10008462B2Jun 26, 2018
Semiconductor package
SAMSUNG ELECTRONICS CO LTD12 citations84
US9831202B2Nov 28, 2017
Semiconductor devices with solder-based connection terminals and method of forming the same
SAMSUNG ELECTRONICS CO LTD11 citations84
US10867970B2Dec 15, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations73
US10658341B2May 19, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations73
US10373935B2Aug 6, 2019
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations73
US10134702B2Nov 20, 2018
Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip
SAMSUNG ELECTRONICS CO LTD4 citations73
US9376541B2Jun 28, 2016
Non-conductive film and non-conductive paste including zinc particles, semiconductor package including the same, and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD4 citations71
US11610865B2Mar 21, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US10991677B2Apr 27, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US12433050B2Sep 30, 2025
Semiconductor package with protective mold
SAMSUNG ELECTRONICS CO LTD0 citations59
US12040337B2Jul 16, 2024
Semiconductor package with protective mold
SAMSUNG ELECTRONICS CO LTD1 citations59
US9136255B2Sep 15, 2015
Methods of fabricating package stack structure and method of mounting package stack structure on system board
SAMSUNG ELECTRONICS CO LTD0 citations51