Inventor
CHANG WEI-CHAN
TW7 patents
Patents
7 patentsUS11133246B1Sep 28, 2021
Semiconductor structure employing conductive paste on lead frame
VANGUARD INT SEMICONDUCT CORP3 citations72
US11810804B2Nov 7, 2023
Method of forming dice and structure of die
VANGUARD INT SEMICONDUCT CORP0 citations61
US11588036B2Feb 21, 2023
High-efficiency packaged chip structure and electronic device including the same
VANGUARD INT SEMICONDUCT CORP0 citations61
US11309201B2Apr 19, 2022
Method of forming dice and structure of die
VANGUARD INT SEMICONDUCT CORP0 citations61
US12131973B2Oct 29, 2024
Semiconductor device and method forming the same
VANGUARD INT SEMICONDUCT CORP0 citations58
US12588235B2Mar 24, 2026
Semiconductor structure and manufacturing method of the same
VANGUARD INT SEMICONDUCT CORP0 citations48
US11935878B2Mar 19, 2024
Package structure and method for manufacturing the same
VANGUARD INT SEMICONDUCT CORP0 citations48