Inventor

TAKANEZAWA SHIN

JP29 patents

⚠️ This page may combine multiple inventors who share the name “TAKANEZAWA SHIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAKANEZAWA SHIN

HITACHI CHEMICAL CO LTD

Multilayer printed circuit board with epoxy resin and carboxylated rubber as adhesive

Process for producing printed wiring board

Process for producing printed wiring boards

Resin composition and its use in production of multilayer printed circuit board

Resin composition which can be cured by application of heat or irradiation of light, film, laminate and production of multilayer wiring board

Insulation material, film, circuit board and method of producing them

Adhesion assisting agent fitted metal foil, and printed wiring board using thereof

Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same

Adhesive clad insulating substrate used for producing printed circuit boards

Interlayer insulating film and method for producing same

Adhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 ppm or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agent

Adhesive for printed wiring board and production thereof

Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board

Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same

Prepreg for coreless substrate, coreless substrate and semiconductor package

Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same

Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board

Coreless substrate prepreg, coreless substrate, coreless substrate manufacturing method and semiconductor package

Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board

Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package

Support-provided insulating layer, laminate, and wiring board

Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, film with resin, laminated plate, multilayer printed wiring board, and semiconductor package

KOTAKE TOMOHIKO

Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using same

Prepreg, laminate obtained with the same and printed-wiring board

MORITA KOUJI

Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board

TAKAI KENJI

Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board

NAGAI SHUNSUKE

Resin composition, and printed wiring board, laminated sheet, and prepreg using same

MORITA KOJI

Resin composition, prepreg, laminate, and wiring board

MIYATAKE MASATO

Resin composition, prepreg laminate obtained with the same and printed-wiring board